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Inventor:
Yagi; Yoshihiko
Address:
Hyogo, JP
No. of patents:
10
Patents:












Patent Number Title Of Patent Date Issued
8208270 Substrate joining member and three-dimensional structure using the same June 26, 2012
Three-dimensional structure (40) of the present invention includes first module board (28), second module board (37), and substrate joining member (10) that unifies board (28) and board (37) into one body, thereby electrically connecting these two elements together. The unification is
8159829 Relay substrate, method for manufacturing the relay substrate and three-dimensional circuit devi April 17, 2012
Relay substrate (1) connecting between at least a first circuit board and a second circuit board, including housing (10) having recess (10a) provided in the outer circumference and hole (22) provided in the inner circumference; plural connecting terminal electrodes (12a, 12c) connect
8134081 Three-dimensional circuit board and its manufacturing method March 13, 2012
A three-dimensional circuit board is formed by comprising a board, a first wiring-electrode group provided on a plurality of steps above the board, and a second wiring-electrode connected to the first wiring-electrode group at least in an altitude direction, in which at least a conne
8120188 Electronic component mounting structure and method for manufacturing the same February 21, 2012
An electronic component mounting structure includes an electronic component provided with a plurality of electrode terminals, and a mounting substrate provided with connector terminals in positions corresponding to the electrode terminals. An electrode terminal is connected to a conn
8119449 Method of manufacturing an electronic part mounting structure February 21, 2012
An electronic part mounting structure includes electronic part having a plurality of electrode terminals, a substrate provided with connection terminals in locations corresponding to these electrode terminals, and protruding electrode for connecting one of electrode terminals and one of
8018731 Interconnect substrate and electronic circuit mounted structure September 13, 2011
Interconnect substrate (1) that connects at least the first circuit board and the second circuit board. Interconnect substrate (1) includes housing (1) and connecting terminal electrodes for connecting the top and bottom faces of housing (10). Housing (10) has protrusion (11) on its oute
7928566 Conductive bump, method for manufacturing the conductive bump, semiconductor device and method f April 19, 2011
Conductive bump (17) formed on a surface of electrode terminal (11) of an electronic component. Conductive bump (17) is composed of at least a plurality of cured resin materials having different conductive filler densities. Thus, a short circuit and a connection failure due to crush of
7845954 Interconnecting board and three-dimensional wiring structure using it December 7, 2010
A first circuit board (1) mounted with an electronic component (16) and a second circuit board (2) are vertically connected three-dimensionally through an interconnecting board (3) wherein the terminal portion (6) of the land electrode (5) on the interconnecting board (3) is buried in th
7762819 Substrate connecting member and connecting structure July 27, 2010
A substrate connecting member connects two circuit boards connected together while maintaining high reliability of the junctions between itself and the circuit boards even if the circuit boards are warped by temperature change of an impact load. The substrate connecting member includ
7659148 Bonding method and apparatus February 9, 2010
A bonding method and an apparatus that enable metal bonding under the atmospheric pressure and at room temperature, wherein the surfaces of objects (1b, 2a) to be bonded together are cleaned in an initial cleaning step (S1) to remove bonding inhibitor substances (G) such as oxides and










 
 
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