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Browse by: INVENTOR PATENT HOLDER PATENT NUMBER DATE
 
 
Inventor:
Xu; Youzhi E.
Address:
Gilbert, AZ
No. of patents:
4
Patents:












Patent Number Title Of Patent Date Issued
7926697 Underfill formulation and method of increasing an adhesion property of same April 19, 2011
An underfill formulation includes a solvent (110), a plurality of amphiphilic block copolymers (120) in the solvent, and an adhesion promoter (130) in the solvent. Groups of the plurality of amphiphilic block copolymers form a plurality of micelles (140) in the solvent, with the mice
7704798 Electronic assemblies with hot spot cooling and methods relating thereto April 27, 2010
A composite of two or more thermal interface materials ("TIMs") is placed between a die and a heat spreader to improve cooling of the die in an integrated circuit package. The two or more TIMs vary in heat-dissipation capability depending upon the locations of die hot spots. In an em
7489033 Electronic assembly with hot spot cooling February 10, 2009
A composite of two or more thermal interface materials ("TIMs") is placed between a die and a heat spreader to improve cooling of the die in an integrated circuit package. The two or more TIMs vary in heat-dissipation capability depending upon the locations of die hot spots. In an em
6761813 Heat transfer through covalent bonding of thermal interface material July 13, 2004
A thermal interface material may be covalently bonded to a bottom surface of a heat dissipating device and/or a backside surface of a heat generating device. The heat dissipating device may be thermally coupled to the heat generating device, the thermal interface material disposed be










 
 
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