| Patent Number |
Title Of Patent |
Date Issued |
| 7926697 |
Underfill formulation and method of increasing an adhesion property of same |
April 19, 2011 |
| An underfill formulation includes a solvent (110), a plurality of amphiphilic block copolymers (120) in the solvent, and an adhesion promoter (130) in the solvent. Groups of the plurality of amphiphilic block copolymers form a plurality of micelles (140) in the solvent, with the mice |
| 7704798 |
Electronic assemblies with hot spot cooling and methods relating thereto |
April 27, 2010 |
| A composite of two or more thermal interface materials ("TIMs") is placed between a die and a heat spreader to improve cooling of the die in an integrated circuit package. The two or more TIMs vary in heat-dissipation capability depending upon the locations of die hot spots. In an em |
| 7489033 |
Electronic assembly with hot spot cooling |
February 10, 2009 |
| A composite of two or more thermal interface materials ("TIMs") is placed between a die and a heat spreader to improve cooling of the die in an integrated circuit package. The two or more TIMs vary in heat-dissipation capability depending upon the locations of die hot spots. In an em |
| 6761813 |
Heat transfer through covalent bonding of thermal interface material |
July 13, 2004 |
| A thermal interface material may be covalently bonded to a bottom surface of a heat dissipating device and/or a backside surface of a heat generating device. The heat dissipating device may be thermally coupled to the heat generating device, the thermal interface material disposed be |
