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Browse by: INVENTOR PATENT HOLDER PATENT NUMBER DATE
 
 
Inventor:
Wu; Shu-Yau
Address:
Artesia, CA
No. of patents:
5
Patents:












Patent Number Title Of Patent Date Issued
6075309 Broadband piezoelectric shunts for structural vibration control June 13, 2000
A negative capacitance converter is used in combination with a buffer circuit to form an electrical shunt circuit. The negative capacitance converter and the buffer circuit, together, minimize or eliminate oscillations of a negative impedance generated by the electrical shunt circuit
6052879 Method for embedding piezoelectric transducers in thermoplastic composites April 25, 2000
A method for embedding piezoelectric ceramic transducers in thermoplastic composites. The piezoelectric ceramic transducer to be embedded in a graphite/PEEK composite is first bonded with two fine silver wires for electrical connection, one on each major surface. The bonding agent is a
5920145 Method and structure for embedding piezoelectric transducers in thermoplastic composites July 6, 1999
This invention consists of a method for embedding piezoelectric ceramic transducers in thermoplastic composites. The piezoelectric ceramic transducer to be embedded in a graphite/PEEK composite is first bonded with two fine silver wires for electrical connection, one on each major su
5814729 System for in-situ delamination detection in composites September 29, 1998
In a system for in-situ delamination detection in composites, the invention employs a system which evaluates the mechanical vibration response of composite material structures. The damping characteristics of the composite structure are extracted from the detected wave properties gene
5783898 Piezoelectric shunts for simultaneous vibration reduction and damping of multiple vibration mode July 21, 1998
A mechanical vibration control device includes a piezoelectric material having a pair of electrical leads extending therefrom, and a shunt circuit connected across the electrical leads of the piezoelectric material. The shunt circuit includes an energy dissipation circuit element having










 
 
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