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Browse by: INVENTOR PATENT HOLDER PATENT NUMBER DATE
 
 
Inventor:
Wood; Alan G.
Address:
Boise, ID
No. of patents:
370
Patents:


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Patent Number Title Of Patent Date Issued
RE36469 Packaging for semiconductor logic devices December 28, 1999
A logic module design is disclosed which incorporates an unencapsulated wafer section or sections. The disclosed module is an improvement over previous designs in that it is less expensive and easier to manufacture due to the reduced number of components and the complexity of the com
RE36325 Directly bonded SIMM module October 5, 1999
A leadframe interconnect package is tape automated bond (TAB) bonded to circuitry on the chip and which provides a circuit connection for subsequent connection to a printed circuit board. The encapsulated chips will replace both the leadframe and printed circuit board (electrical onl
D402638 Temporary package for semiconductor dice December 15, 1998
D401567 Temporary package for semiconductor dice November 24, 1998
D394844 Temporary package for semiconductor dice June 2, 1998
8581387 Through wire interconnect (TWI) having bonded connection and encapsulating polymer layer November 12, 2013
A through wire interconnect for a semiconductor substrate includes a via extending through the semiconductor substrate from a first side to a second side thereof, and a wire in the via electrically insulated from the semiconductor substrate having a first end with a bonded connection
8294273 Methods for fabricating and filling conductive vias and conductive vias so formed October 23, 2012
Methods for forming conductive vias include forming one or more via holes in a substrate. The via holes may be formed with a single mask, with protective layers, bond pads, or other features of the substrate acting as hard masks in the event that a photomask is removed during etching
8258006 Method for fabricating stacked semiconductor components September 4, 2012
A semiconductor component includes a carrier and multiple semiconductor substrates stacked and interconnected on the carrier. The carrier includes conductive members bonded to corresponding conductive openings on the semiconductor substrates. The component can also include terminal c
8217510 Semiconductor module system having stacked components with encapsulated through wire interconnec July 10, 2012
A semiconductor module system includes a module substrate and first and second semiconductor components stacked on the module substrate. The stacked semiconductor components include through wire interconnects that form an internal signal transmission system for the module system. Each
8193646 Semiconductor component having through wire interconnect (TWI) with compressed wire June 5, 2012
A semiconductor component includes a semiconductor substrate having a substrate contact, and a through wire interconnect (TWI) bonded to the substrate contact. The through wire interconnect (TWI) includes a via through the substrate contact and the substrate, a wire in the via bonded
8187983 Methods for fabricating semiconductor components using thinning and back side laser processing May 29, 2012
A method for fabricating semiconductor components includes the steps of providing a semiconductor substrate having a circuit side, a back side and integrated circuits and circuitry on the circuit side; thinning the substrate from the back side to a selected thickness; laser processing
8120167 System with semiconductor components having encapsulated through wire interconnects (TWI) February 21, 2012
A method for fabricating a semiconductor component with an encapsulated through wire interconnect includes the steps of providing a substrate having a first side, a second side and a substrate contact; forming a via in the substrate contact and the substrate to the second side; placing a
8062958 Microelectronic device wafers and methods of manufacturing November 22, 2011
Methods of forming microelectronic device wafers include fabricating a plurality of semiconductor dies at an active side of a semiconductor wafer, depositing a mask on the semiconductor wafer, removing a central portion of the mask and the semiconductor wafer, and etching. The semico
8053857 Packaged microelectronic imagers and methods of packaging microelectronic imagers November 8, 2011
Methods for forming electrically conductive through-wafer interconnects in microelectronic devices and microelectronic devices are disclosed herein. In one embodiment, a microelectronic device can include a monolithic microelectronic substrate with an integrated circuit has a front s
7960829 Support structure for use in thinning semiconductor substrates and for supporting thinned semico June 14, 2011
A support structure for use with a semiconductor substrate in thinning, or backgrinding, thereof, as well as during post-thinning processing of the semiconductor substrate includes a portion that extends substantially along and around an outer periphery of the semiconductor substrate to
7956443 Through-wafer interconnects for photoimager and memory wafers June 7, 2011
A through-wafer interconnect for imager, memory and other integrated circuit applications is disclosed, thereby eliminating the need for wire bonding, making devices incorporating such interconnects stackable and enabling wafer level packaging for imager devices. Further, a smaller and
7951702 Methods for fabricating semiconductor components with conductive interconnects having planar sur May 31, 2011
A backside method for fabricating a semiconductor component with a conductive interconnect includes the step of providing a semiconductor substrate having a circuit side, a backside, and a substrate contact on the circuit side. The method also includes the steps of forming a substrat
7935991 Semiconductor components with conductive interconnects May 3, 2011
A semiconductor component includes a semiconductor substrate having at least one conductive interconnect on the backside thereof bonded to an inner surface of a substrate contact. A stacked semiconductor component includes multiple semiconductor components in a stacked array having b
7892972 Methods for fabricating and filling conductive vias and conductive vias so formed February 22, 2011
Methods for forming conductive vias include forming one or more via holes in a substrate. The via holes may be formed with a single mask, with protective layers, bond pads, or other features of the substrate acting as hard masks in the event that a photomask is removed during etching
7883908 Method for fabricating semiconductor component having encapsulated through wire interconnect (TW February 8, 2011
A method for fabricating a semiconductor component with an encapsulated through wire interconnect includes the steps of providing a substrate having a first side, a second side and a substrate contact; forming a via in the substrate contact and the substrate to the second side; placing a
7880307 Semiconductor device including through-wafer interconnect structure February 1, 2011
Semiconductor devices including through-wafer interconnects are disclosed. According to an embodiment of the present invention, a semiconductor device may comprise a substrate having a first surface and a second, opposing surface, and a through-wafer interconnect extending into the f
7858429 Packaged microelectronic imagers and methods of packaging microelectronic imagers December 28, 2010
Microelectronic imagers, methods for packaging microelectronic imagers, and methods for forming electrically conductive through-wafer interconnects in microelectronic imagers are disclosed herein. In one embodiment, a microelectronic imaging die can include a microelectronic substrat
7855140 Method of forming vias in semiconductor substrates and resulting structures December 21, 2010
Methods for forming through vias in a semiconductor substrate and resulting structures are disclosed. In one embodiment, a through via may be formed by forming a partial via from an active surface through a conductive element thereon and a portion of the substrate underlying the cond
7833832 Method of fabricating semiconductor components with through interconnects November 16, 2010
A method for fabricating a semiconductor component with through interconnects can include the steps of providing a semiconductor substrate with substrate contacts, and forming openings from a backside of the substrate aligned with the substrate contacts. The method can also include t
7807505 Methods for wafer-level packaging of microfeature devices and microfeature devices formed using October 5, 2010
Methods for wafer-level packaging of microfeature devices and microfeature devices formed using such methods are disclosed herein. A method for packaging microfeature devices in accordance with an embodiment of the invention can include releasably attaching a plurality of first known
7791184 Image sensor packages and frame structure thereof September 7, 2010
A semiconductor package such as an image sensor package. A frame structure includes an array of frames, each having an aperture therethrough, into which an image sensor die in combination with a cover glass, filter, lens or other components may be installed in precise mutual alignment.
7786605 Stacked semiconductor components with through wire interconnects (TWI) August 31, 2010
A semiconductor component includes a semiconductor substrate having a substrate contact, and a through wire interconnect (TWI) bonded to the substrate contact. The through wire interconnect (TWI) includes a via through the substrate contact and the substrate, a wire in the via bonded
7776647 Semiconductor components and methods of fabrication with circuit side contacts, conductive vias August 17, 2010
A semiconductor component includes a thinned semiconductor substrate having protective polymer layers on up to six surfaces. The component also includes contacts on a circuit side of the substrate, conductive vias in electrical contact with the contacts, and conductors on a backside
7768096 System for fabricating semiconductor components with conductive interconnects August 3, 2010
A system for fabricating semiconductor components includes a semiconductor substrate, a thinning system for thinning the semiconductor substrate, an etching system for forming the substrate opening, and a bonding system for bonding the conductive interconnect to the substrate contact. Th
7727872 Methods for fabricating semiconductor components with conductive interconnects June 1, 2010
A system for fabricating semiconductor components includes a semiconductor substrate, a thinning system for thinning the semiconductor substrate, an etching system for forming the substrate opening, and a bonding system for bonding the conductive interconnect to the substrate contact. Th
7723741 Spacers for packaged microelectronic imagers and methods of making and using spacers for wafer-l May 25, 2010
Methods of packaging microelectronic imagers and packaged microelectronic imagers. An embodiment of such a method can include providing an imager workpiece having a plurality of imager dies arranged in a die pattern and providing a cover substrate through which a desired radiation can
7713841 Methods for thinning semiconductor substrates that employ support structures formed on the subst May 11, 2010
A support structure for use with a semiconductor substrate in thinning, or backgrinding, thereof, as well as during post-thinning processing of the semiconductor substrate includes a portion which extends substantially along and around an outer periphery of the semiconductor substrate to
7709776 Microelectronic imagers with optical devices and methods of manufacturing such microelectronic i May 4, 2010
Microelectronic imager assemblies comprising a workpiece including a substrate and a plurality of imaging dies on and/or in the substrate. The substrate includes a front side and a back side, and the imaging dies comprise imaging sensors at the front side of the substrate and external
7683458 Through-wafer interconnects for photoimager and memory wafers March 23, 2010
A through-wafer interconnect for imager, memory and other integrated circuit applications is disclosed, thereby eliminating the need for wire bonding, making devices incorporating such interconnects stackable and enabling wafer level packaging for imager devices. Further, a smaller and
7663096 Microelectronic imaging devices and associated methods for attaching transmissive elements February 16, 2010
Microelectronic imaging devices and associated methods for attaching transmissive elements are disclosed. A manufacturing method in accordance with one embodiment of the invention includes providing an imager workpiece having multiple image sensor dies configured to detect energy ove
7659612 Semiconductor components having encapsulated through wire interconnects (TWI) February 9, 2010
A semiconductor component includes a semiconductor substrate having a substrate contact, and a through wire interconnect (TWI) attached to the substrate contact. The through wire interconnect provides a multi level interconnect having contacts on opposing first and second sides of the
7645635 Frame structure and semiconductor attach process for use therewith for fabrication of image sens January 12, 2010
A semiconductor package such as an image sensor package, and methods for fabrication. A frame structure includes an array of frames, each having an aperture therethrough, into which an image sensor die in combination with a cover glass, filter, lens or other components may be installed i
7598167 Method of forming vias in semiconductor substrates without damaging active regions thereof and r October 6, 2009
Methods for forming through vias in a semiconductor substrate and resulting structures are disclosed. In one embodiment, a through via may be formed by forming a partial via from the active surface through a conductive element thereon and a portion of the semiconductor substrate unde
7591069 Methods of bonding solder balls to bond pads on a substrate, and bonding frames September 22, 2009
Methods and apparatuses for bonding solder balls to bond pads are described. In one embodiment, portions of a plurality of solder balls are placed within a frame and in registered alignment with individual bond pads over a substrate. While the ball portions are within the frame, the
7589406 Stacked semiconductor component September 15, 2009
A semiconductor component includes a carrier and multiple semiconductor substrates stacked and interconnected on the carrier. The carrier includes conductive members bonded to corresponding conductive openings on the semiconductor substrates. The component can also include terminal c
7589010 Semiconductor devices with permanent polymer stencil and method for manufacturing the same September 15, 2009
Methods of manufacturing semiconductor devices using permanent or temporary polymer layers having apertures to expose contact pads and cover the active surfaces of the semiconductor devices.
7579267 Methods and systems for fabricating semiconductor components with through wire interconnects (TW August 25, 2009
A semiconductor component includes a semiconductor substrate having a substrate contact, and a through wire interconnect (TWI) bonded to the substrate contact. The through wire interconnect (TWI) includes a via through the substrate contact and the substrate, a wire in the via bonded
7561938 Method for using data regarding manufacturing procedures integrated circuits (ICS) have undergon July 14, 2009
An inventive method in an integrated circuit (IC) manufacturing process for using data regarding repair procedures conducted on ICs at probe to determine whether any further repairs will be conducted later in the manufacturing process includes storing the data in association with a f
7538413 Semiconductor components having through interconnects May 26, 2009
A semiconductor component includes a semiconductor substrate having a substrate contact on a circuit side thereof in electrical communication with an integrated circuit, and a through interconnect in physical and electrical contact with the substrate contact configured to provide a s
7521296 Methods of fabricating a microlens including selectively curing flowable, uncured optically tras April 21, 2009
Microlenses for directing radiation toward a sensor of an imaging device include a plurality of mutually adhered layers of cured optically transmissive material. Systems include at least one microprocessor and a substrate including an array of microlenses formed thereon in electrical
7511520 Universal wafer carrier for wafer level die burn-in March 31, 2009
A reusable burn-in/test fixture for testing unsingulated dice on a semiconductor wafer consisting of two halves. The first half of the test fixture is a wafer cavity plate for receiving the wafer, and the second half establishes electrical communication between the wafer and electric
7504615 Microelectronic imagers with optical devices and methods of manufacturing such microelectronic i March 17, 2009
Microelectronic imager assemblies comprising a workpiece including a substrate and a plurality of imaging dies on and/or in the substrate. The substrate includes a front side and a back side, and the imaging dies comprise imaging sensors at the front side of the substrate and external
7498675 Semiconductor component having plate, stacked dice and conductive vias March 3, 2009
A semiconductor component includes a base die and a secondary die stacked on and bonded to the base die. The base die includes conductive vias which form an internal signal transmission system for the component, and allow the circuit side of the secondary die to be bonded to the back sid
7488899 Compliant contact pin assembly and card system February 10, 2009
A compliant contact pin assembly and a contactor card system are provided. The compliant contact pin assembly includes a contact pin formed from a portion of a substrate with the contact pin compliantly held suspended within the substrate by a compliant coupling structure. The suspension
7488618 Microlenses including a plurality of mutually adhered layers of optically transmissive material February 10, 2009
Microlenses for directing radiation toward a sensor of an imaging device include a plurality of mutually adhered layers of cured optically transmissive material. Systems include at least one microprocessor and a substrate including an array of microlenses formed thereon in electrical
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