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Browse by: INVENTOR PATENT HOLDER PATENT NUMBER DATE
 
 
Inventor:
White; George E.
Address:
Marietta, GA
No. of patents:
9
Patents:












Patent Number Title Of Patent Date Issued
8013688 Liquid crystalline polymer and multilayer polymer-based passive signal processing components for September 6, 2011
The present invention provides all organic fully-packaged miniature bandpass filters, baluns, diplexers, multiplexers, couplers and a combination of the above manufactured using liquid crystalline polymer (LCP) and other multilayer polymer based substrates. These devices are manufact
7989895 Integration using package stacking with multi-layer organic substrates August 2, 2011
Example embodiments of the invention may provide for a multi-package system. The multi-package system may include a first package having a plurality of first organic dielectric layers, where the first package includes at least one first conductive layer positioned between two of the
7808434 Systems and methods for integrated antennae structures in multilayer organic-based printed circu October 5, 2010
Embodiments of the invention may provide for a variety of antennae structures, including the following: a) antennae structures printed directly on the sides of the radio frequency (RF) module or integrated passive device (IPD), b) printed antennae structures fabricated on preformed d
7805834 Method for fabricating three-dimensional all organic interconnect structures October 5, 2010
The present invention includes methods for making liquid crystalline polymer (LCP) interconnect structures using a high temperature and low temperature single sided LCP, where both the high and low temperature LCP are provided with a z-axis connection. The single sided conductive layer
7795995 Liquid crystalline polymer and multilayer polymer-based passive signal processing components for September 14, 2010
The present invention provides all organic fully-packaged miniature bandpass filters, baluns, diplexers, multiplexers, couplers and a combination of the above manufactured using liquid crystalline polymer (LCP) and other multilayer polymer based substrates. These devices are manufact
7260890 Methods for fabricating three-dimensional all organic interconnect structures August 28, 2007
The present invention includes methods for making liquid crystalline polymer (LCP) interconnect structures using a high temperature and low temperature single sided liquid crystalline polymer LCP where both the high and low temperature LCP are drilled to form a z-axis connection. The
7068124 Integrated passive devices fabricated utilizing multi-layer, organic laminates June 27, 2006
The present invention includes an organic device that can be integrated in a multilayer board made of organic material. The passive devices can be integrally fabricated on a circuit board in either surface mount device (SMD) or ball grid array (BGA) form. Alternatively, the passive devic
6987307 Stand-alone organic-based passive devices January 17, 2006
The present invention provides for low cost discrete inductor devices in an all organic platform. The inductor devices can utilize virtually any organic material that provides the desired properties, such as liquid crystalline polymer (LCP) or polyphenyl ether (PPE), in a multilayer
6900708 Integrated passive devices fabricated utilizing multi-layer, organic laminates May 31, 2005
The present invention includes an organic device that can be integrated in a multilayer board made of organic material. The passive devices can be integrally fabricated on a circuit board in either surface mount device (SMD) or ball grid array (BGA) form. Alternatively, the passive devic










 
 
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