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Weekamp; Johannes W.
Beek en Donk, NL
No. of patents:

Patent Number Title Of Patent Date Issued
8138596 Method for manufacturing an element having electrically conductive members for application in a March 20, 2012
A microelectronic package (31) has a microelectronic device, which is encapsulated in a quantity of material (27), and a lead frame element (15) for enabling the microelectronic device to be electrically contacted from outside of the package (31). The lead frame element (15) comprises
7884289 Method for manufacturing an electronic assembly; an electronic assembly, a cover and a substrate February 8, 2011
The present invention relates to a method for manufacturing an electronic assembly (50) comprising an electronic component, a cavity and a substrate which method comprises; --providing an electronic component (10) having a first pattern with a substantially closed configuration; --pr
6370228 X-ray filter and x-ray examination apparatus using the same April 9, 2002
An X-ray filter comprises an array of filter elements (5) an control circuit, the control circuit comprising an array of switching devices (33) provided on a common substrate (52), a switching device (33) being provided for each filter element for switching a control signal to the re

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