A microelectronic package (31) has a microelectronic device, which is encapsulated in a quantity of material (27), and a lead frame element (15) for enabling the microelectronic device to be electrically contacted from outside of the package (31). The lead frame element (15) comprises
The present invention relates to a method for manufacturing an electronic assembly (50) comprising an electronic component, a cavity and a substrate which method comprises; --providing an electronic component (10) having a first pattern with a substantially closed configuration; --pr
An X-ray filter comprises an array of filter elements (5) an control circuit, the control circuit comprising an array of switching devices (33) provided on a common substrate (52), a switching device (33) being provided for each filter element for switching a control signal to the re
