| Patent Number |
Title Of Patent |
Date Issued |
| 6967395 |
Mounting for a package containing a chip |
November 22, 2005 |
| A mounting for a package containing a semiconductor chip is disclosed, along with methods of making such a mounting. The mounting includes a substrate having a mounting surface with conductive traces thereon, and an aperture extending through the substrate. The package includes a base, |
| 6875379 |
Tool and method for forming an integrated optical circuit |
April 5, 2005 |
| Tools and methods for making molded an optical integrated circuit including one or more waveguides are disclosed. In one embodiment, a molding die is provided that includes a substrate that has a topographically patterned first surface. A conformal protective film is provided over the fi |
| 6777789 |
Mounting for a package containing a chip |
August 17, 2004 |
| A mounting for a package containing a semiconductor chip is disclosed, along with methods of making such a mounting. The mounting includes a substrate having a mounting surface with conductive traces thereon, and an aperture extending through the substrate. The package includes a base, |
| 6627987 |
Ceramic semiconductor package and method for fabricating the package |
September 30, 2003 |
| A sealed ceramic package for a semiconductor device and a method of fabricating the same are disclosed. In one embodiment, a ceramic substrate has a set of cavities each having an opening at a substrate top surface. A semiconductor die is disposed within each cavity, and is electrically |
| 6586826 |
Integrated circuit package having posts for connection to other packages and substrates |
July 1, 2003 |
| Integrated circuit packages that may be easily stacked one on top of the other are disclosed. The package includes a molded plastic body having metal-coated interconnection posts on both its upper and lower surfaces. An integrated circuit is mounted on the upper surface. Metal traces on |
| 6545345 |
Mounting for a package containing a chip |
April 8, 2003 |
| A mounting for a package containing a semiconductor chip is disclosed, along with methods of making such a mounting. The mounting includes a substrate having a mounting surface with conductive traces thereon, and an aperture extending through the substrate. The package includes a base, |
| 6528875 |
Vacuum sealed package for semiconductor chip |
March 4, 2003 |
| A vacuum sealed package for a semiconductor chip, such as a micro-electromechanical (MEM) chip, is disclosed, along with a method of making such a package. In an exemplary embodiment, the package includes a ceramic substrate and a lid that together define a cavity wherein the chip is |
| 6429513 |
Active heat sink for cooling a semiconductor chip |
August 6, 2002 |
| Semiconductor packages and other electronic assemblies having an active heat sink are disclosed, along with methods of making the same. The active heat sink includes a cavity partially filled with a heat activated liquid. Heat generated during operation of a chip boils the heat activated |
