Resources Contact Us Home
Watts; David
Austin, TX
No. of patents:

Patent Number Title Of Patent Date Issued
5935871 Process for forming a semiconductor device August 10, 1999
A process has been developed for a post-chemical mechanical polishing cleaning/passivting step to remove slurry particles (52) and form a passivating film (64) from a portion of an interconnect material within a conductive layer (42) without attacking the interconnecting material. In
5897375 Chemical mechanical polishing (CMP) slurry for copper and method of use in integrated circuit ma April 27, 1999
A method for chemical mechanical polishing (CMP) a copper layer (22) begins by forming the copper layer (22). The copper layer (22) is then exposed to a slurry (24). The slurry (24) contains an oxidizing agent such as H.sub.2 O.sub.2, a carboxylate salt such as ammonium citrate, an abras

  Recently Added Patents
Electro-optic device and electronic apparatus
Decorative strip for showers
Method of distributing PCC rules among IP-connectivity access network (IP-CAN) bearers
Integrated circuit packaging system with support structure and method of manufacture thereof
Session initiation using successive inputs
Method and apparatus of transmitting and receiving backhaul downlink control information in a wireless communication system
Piston for an internal combustion engine
  Randomly Featured Patents
Vehicle cigarette lighter power adapter
Multiplier circuit for reducing the number of necessary elements without sacrificing high speed capability
Process for reducing in-mould times for chocolate confections containing reduced calorie fats
Process for producing phase retarder film
Process for treating pigments
Pipe coupling segment
Method and apparatus for parsing commands
Steam turbine with an improved cooling system for the casing
Transparent envelope with foldable pocket flap for information display
Method and apparatus for managing proxy and non-proxy requests in telecommunications network