Resources Contact Us Home
Watts; David
Austin, TX
No. of patents:

Patent Number Title Of Patent Date Issued
5935871 Process for forming a semiconductor device August 10, 1999
A process has been developed for a post-chemical mechanical polishing cleaning/passivting step to remove slurry particles (52) and form a passivating film (64) from a portion of an interconnect material within a conductive layer (42) without attacking the interconnecting material. In
5897375 Chemical mechanical polishing (CMP) slurry for copper and method of use in integrated circuit ma April 27, 1999
A method for chemical mechanical polishing (CMP) a copper layer (22) begins by forming the copper layer (22). The copper layer (22) is then exposed to a slurry (24). The slurry (24) contains an oxidizing agent such as H.sub.2 O.sub.2, a carboxylate salt such as ammonium citrate, an abras

  Recently Added Patents
Image generation based on a plurality of overlapped swathes
Solar cell with hyperpolarizable absorber
Solid-state imaging device and imaging apparatus
Determining ill conditioning in square linear system of equations
Aware manufacturing of integrated circuits
Data scrambling in memory devices
Magnetic disk and manufacturing method thereof
  Randomly Featured Patents
Connector handle for an electric vehicle battery charger
Stack plume visualization system
Lens holder
Hand brake control device having adjustable main and auxiliary levers
Punching system
Differential thread collet actuation
Information storage apparatus including an uninterruptible power supply (UPS) and an interlock control method of the same
System and procedure for measuring the performance of applications by means of messages
Method of and device for distilling off secondary substances from oily liquids
Interlock attaching strap system