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Browse by: INVENTOR PATENT HOLDER PATENT NUMBER DATE
 
 
Inventor:
Wark; James M.
Address:
Boise, ID
No. of patents:
164
Patents:


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Patent Number Title Of Patent Date Issued
8294273 Methods for fabricating and filling conductive vias and conductive vias so formed October 23, 2012
Methods for forming conductive vias include forming one or more via holes in a substrate. The via holes may be formed with a single mask, with protective layers, bond pads, or other features of the substrate acting as hard masks in the event that a photomask is removed during etching
7993944 Microelectronic imagers with optical devices having integral reference features and methods for August 9, 2011
Microelectronic imager assemblies with optical devices having integral reference features and methods for assembling such microelectronic imagers is disclosed herein. In one embodiment, the imager assembly can include a workpiece with a substrate having a front side, a back side, and
7956443 Through-wafer interconnects for photoimager and memory wafers June 7, 2011
A through-wafer interconnect for imager, memory and other integrated circuit applications is disclosed, thereby eliminating the need for wire bonding, making devices incorporating such interconnects stackable and enabling wafer level packaging for imager devices. Further, a smaller and
7928579 Devices including sloped vias in a substrate and devices including spring-like deflecting contac April 19, 2011
Methods for forming vias are disclosed. The methods include providing a substrate having a first surface and an opposing, second surface. The vias are formed within the substrate to have a longitudinal axis sloped at an angle with respect to a reference line extending perpendicular to
7892972 Methods for fabricating and filling conductive vias and conductive vias so formed February 22, 2011
Methods for forming conductive vias include forming one or more via holes in a substrate. The via holes may be formed with a single mask, with protective layers, bond pads, or other features of the substrate acting as hard masks in the event that a photomask is removed during etching
7855454 Semiconductor device structures including nickel plated aluminum, copper, and tungsten structure December 21, 2010
A method of activating a metal structure on an intermediate semiconductor device structure toward metal plating. The method comprises providing an intermediate semiconductor device structure comprising at least one first metal structure and at least one second metal structure on a se
7812436 Methods for stacking wire-bonded integrated circuit dice on flip-chip bonded integrated circuit October 12, 2010
An inventive electronic device, such as a multi-chip module (MCM), a Single In-line Memory Module (SIMM), or a Dual In-line Memory Module (DIMM), includes a base, such as a printed circuit board, having a surface on which flip-chip pads and wire-bondable pads are provided. The flip-c
7776652 Methods for stacking wire-bonded integrated circuit dice on flip-chip bonded integrated circuit August 17, 2010
An inventive electronic device, such as a multi-chip module (MCM), a Single In-line Memory Module (SIMM), or a Dual In-line Memory Module (DIMM), includes a base, such as a printed circuit board, having a surface on which flip-chip pads and wire-bondable pads are provided. The flip-c
7730372 Device and method for testing integrated circuit dice in an integrated circuit module June 1, 2010
An IC module, such as a Multi-Chip Module (MCM), includes multiple IC dice, each having a test mode enable bond pad, such as an output enable pad. A fuse incorporated into the MCM's substrate connects each die's test mode enable bond pad to one of the MCM's no-connection (N/C) pins,
7723741 Spacers for packaged microelectronic imagers and methods of making and using spacers for wafer-l May 25, 2010
Methods of packaging microelectronic imagers and packaged microelectronic imagers. An embodiment of such a method can include providing an imager workpiece having a plurality of imager dies arranged in a die pattern and providing a cover substrate through which a desired radiation can
7709776 Microelectronic imagers with optical devices and methods of manufacturing such microelectronic i May 4, 2010
Microelectronic imager assemblies comprising a workpiece including a substrate and a plurality of imaging dies on and/or in the substrate. The substrate includes a front side and a back side, and the imaging dies comprise imaging sensors at the front side of the substrate and external
7683458 Through-wafer interconnects for photoimager and memory wafers March 23, 2010
A through-wafer interconnect for imager, memory and other integrated circuit applications is disclosed, thereby eliminating the need for wire bonding, making devices incorporating such interconnects stackable and enabling wafer level packaging for imager devices. Further, a smaller and
7589010 Semiconductor devices with permanent polymer stencil and method for manufacturing the same September 15, 2009
Methods of manufacturing semiconductor devices using permanent or temporary polymer layers having apertures to expose contact pads and cover the active surfaces of the semiconductor devices.
7561938 Method for using data regarding manufacturing procedures integrated circuits (ICS) have undergon July 14, 2009
An inventive method in an integrated circuit (IC) manufacturing process for using data regarding repair procedures conducted on ICs at probe to determine whether any further repairs will be conducted later in the manufacturing process includes storing the data in association with a f
7519881 Device and method for testing integrated circuit dice in an integrated circuit module April 14, 2009
An IC module, such as a Multi-Chip Module (MCM), includes multiple IC dice, each having a test mode enable bond pad, such as an output enable pad. A fuse incorporated into the MCM's substrate connects each die's test mode enable bond pad to one of the MCM's no-connection (N/C) pins,
7504615 Microelectronic imagers with optical devices and methods of manufacturing such microelectronic i March 17, 2009
Microelectronic imager assemblies comprising a workpiece including a substrate and a plurality of imaging dies on and/or in the substrate. The substrate includes a front side and a back side, and the imaging dies comprise imaging sensors at the front side of the substrate and external
7498675 Semiconductor component having plate, stacked dice and conductive vias March 3, 2009
A semiconductor component includes a base die and a secondary die stacked on and bonded to the base die. The base die includes conductive vias which form an internal signal transmission system for the component, and allow the circuit side of the secondary die to be bonded to the back sid
7488899 Compliant contact pin assembly and card system February 10, 2009
A compliant contact pin assembly and a contactor card system are provided. The compliant contact pin assembly includes a contact pin formed from a portion of a substrate with the contact pin compliantly held suspended within the substrate by a compliant coupling structure. The suspension
7459393 Method for fabricating semiconductor components with thinned substrate, circuit side contacts, c December 2, 2008
A method for fabricating a semiconductor component includes the steps of providing a substrate having a contact on a circuit side thereof, forming an opening from a backside of the substrate to the contact, forming a conductive via in the opening in electrical contact with a surface of t
7452743 Microelectronic imaging units and methods of manufacturing microelectronic imaging units at the November 18, 2008
Microelectronic imaging units and methods for manufacturing a plurality of imaging units at the wafer level are disclosed herein. In one embodiment, a method for manufacturing a plurality of imaging units includes providing an imager workpiece having a plurality of imaging dies inclu
7429494 Microelectronic imagers with optical devices having integral reference features and methods for September 30, 2008
Microelectronic imager assemblies with optical devices having integral reference features and methods for assembling such microelectronic imagers is disclosed herein. In one embodiment, the imager assembly can include a workpiece with a substrate having a front side, a back side, and
7423339 Methods for stacking wire-bonded integrated circuit dice on flip-chip bonded integrated circuit September 9, 2008
An inventive electronic device, such as a multi-chip module (MCM), a Single In-line Memory Module (SIMM), or a Dual In-line Memory Module (DIMM), includes a base, such as a printed circuit board, having a surface on which flip-chip pads and wire-bondable pads are provided. The flip-c
7423338 Methods for stacking wire-bonded integrated circuit dice on flip-chip bonded integrated circuit September 9, 2008
An inventive electronic device, such as a multi-chip module (MCM), a Single In-line Memory Module (SIMM), or a Dual In-line Memory Module (DIMM), includes a base, such as a printed circuit board, having a surface on which flip-chip pads and wire-bondable pads are provided. The flip-c
7419841 Microelectronic imagers and methods of packaging microelectronic imagers September 2, 2008
Microelectronic imagers and methods for packaging microelectronic imagers are disclosed herein. In one embodiment, a microelectronic imaging unit can include a microelectronic die, an image sensor, an integrated circuit electrically coupled to the image sensor, and a bond-pad electricall
7411286 Methods for stacking wire-bonded integrated circuit dice on flip-chip bonded integrated circuit August 12, 2008
An inventive electronic device, such as a multi-chip module (MCM), a Single In-line Memory Module (SIMM), or a Dual In-line Memory Module (DIMM), includes a base, such as a printed circuit board, having a surface on which flip-chip pads and wire-bondable pads are provided. The flip-c
7402902 Methods for stacking wire-bonded integrated circuit dice on flip-chip bonded integrated circuit July 22, 2008
An inventive electronic device, such as a multi-chip module (MCM), a Single In-line Memory Module (SIMM), or a Dual In-line Memory Module (DIMM), includes a base, such as a printed circuit board, having a surface on which flip-chip pads and wire-bondable pads are provided. The flip-c
7394267 Compliant contact pin assembly and card system July 1, 2008
A compliant contact pin assembly and a contactor card system are provided. The compliant contact pin assembly includes a contact pin formed from a portion of a substrate with the contact pin compliantly held suspended within the substrate by a compliant coupling structure. The suspension
7390740 Sloped vias in a substrate, spring-like contacts, and methods of making June 24, 2008
Methods for forming vias are disclosed. The methods include providing a substrate having a first surface and an opposing, second surface. The vias are formed within the substrate to have a longitudinal axis sloped at an angle with respect to a reference line extending perpendicular to
7358751 Contact pin assembly and contactor card April 15, 2008
A compliant contact pin assembly and a contactor card system are provided. The compliant contact pin assembly includes a contact pin formed from a portion of a substrate with the contact pin compliantly held suspended within the substrate by a compliant coupling structure. The suspension
7297563 Method of making contact pin card system November 20, 2007
A compliant contact pin contactor card method for making is provided. The compliant contact pin assembly includes a contact pin formed from a portion of a substrate with the contact pin compliantly held suspended within the substrate by a compliant coupling structure. The suspension
7288954 Compliant contact pin test assembly and methods thereof October 30, 2007
A compliant contact pin assembly and a contactor card and methods for testing therewith are provided. The compliant contact pin assembly includes a contact pin formed from a portion of a substrate with the contact pin compliantly held suspended within the substrate by a compliant cou
7287326 Methods of forming a contact pin assembly October 30, 2007
A compliant contact pin assembly method for making is provided. The compliant contact pin assembly includes a contact pin formed from a portion of a substrate with the contact pin compliantly held suspended within the substrate by a compliant coupling structure. The suspension within
7282932 Compliant contact pin assembly, card system and methods thereof October 16, 2007
A compliant contact pin assembly, a contactor card, a testing system and methods for making and testing are provided. A compliant contact pin assembly includes a contact pin formed from a portion of a substrate with the contact pin compliantly held suspended within the substrate by a
7282792 Methods for stacking wire-bonded integrated circuit dice on flip-chip bonded integrated circuit October 16, 2007
An inventive electronic device, such as a multi-chip module (MCM), a Single In-line Memory Module (SIMM), or a Dual In-line Memory Module (DIMM), includes a base, such as a printed circuit board, having a surface on which flip-chip pads and wire-bondable pads are provided. The flip-c
7279407 Selective nickel plating of aluminum, copper, and tungsten structures October 9, 2007
A method of selectively plating nickel on an intermediate semiconductor device structure. The method comprises providing an intermediate semiconductor device structure having at least one aluminum or copper structure and at least one tungsten structure. One of the aluminum or copper
7265330 Microelectronic imagers with optical devices and methods of manufacturing such microelectronic i September 4, 2007
Microelectronic imager assemblies comprising a workpiece including a substrate and a plurality of imaging dies on and/or in the substrate. The substrate includes a front side and a back side, and the imaging dies comprise imaging sensors at the front side of the substrate and external
7224051 Semiconductor component having plate and stacked dice May 29, 2007
A semiconductor component includes a base die and a secondary die stacked on and bonded to the base die. The base die includes conductive vias which form an internal signal transmission system for the component, and allow the circuit side of the secondary die to be bonded to the back sid
7223626 Spacers for packaged microelectronic imagers and methods of making and using spacers for wafer-l May 29, 2007
Methods of packaging microelectronic imagers and packaged microelectronic imagers. An embodiment of such a method can include providing an imager workpiece having a plurality of imager dies arranged in a die pattern and providing a cover substrate through which a desired radiation can
7205661 Projected contact structures for engaging bumped semiconductor devices and methods of making the April 17, 2007
A bumped semiconductor device contact structure is disclosed including at least one non-planar contact pad having a plurality of projections extending therefrom for contacting at least one solder ball of a bumped integrated circuit (IC) device, such as a bumped die and a bumped packa
7199439 Microelectronic imagers and methods of packaging microelectronic imagers April 3, 2007
Microelectronic imagers and methods for packaging microelectronic imagers are disclosed herein. In one embodiment, a microelectronic imaging unit can include a microelectronic die, an image sensor, an integrated circuit electrically coupled to the image sensor, and a bond-pad electricall
7189954 Microelectronic imagers with optical devices and methods of manufacturing such microelectronic i March 13, 2007
Microelectronic imager assemblies comprising a workpiece including a substrate and a plurality of imaging dies on and/or in the substrate. The substrate includes a front side and a back side, and the imaging dies comprise imaging sensors at the front side of the substrate and external
7166915 Multi-chip module system January 23, 2007
Multi-chip module systems and method of fabrication thereof wherein the equivalent of a failed die of a multi-chip module (MCM) is added to the module in a vacancy position previously constructed with appropriate electrical connections. A variety of different dice may be attached to
7162796 Method of making an interposer with contact structures January 16, 2007
A method of making an interposer having an array of contact structures for making temporary electrical contact with the leads of a chip package. The contact structures may make contact with the leads substantially as close as desired to the body of the chip package. Moreover, the contact
7161250 Projected contact structures for engaging bumped semiconductor devices and methods of making the January 9, 2007
A bumped semiconductor device contact structure is disclosed including at least one non-planar contact pad having a plurality of projections extending therefrom for contacting at least one solder ball of a bumped integrated circuit (IC) device, such as a bumped die and a bumped packa
7159311 Method of making an interposer with contact structures January 9, 2007
A method of making an interposer having an array of contact structures for making temporary electrical contact with the leads of a chip package. The contact structures may make contact with the leads substantially as close as desired to the body of the chip package. Moreover, the contact
7155300 Method for using data regarding manufacturing procedures integrated circuits (IC's) have undergo December 26, 2006
An inventive method in an integrated circuit (IC) manufacturing process for using data regarding repair procedures conducted on IC's at probe to determine whether any further repairs will be conducted later in the manufacturing process includes storing the data in association with a
7120513 Method for using data regarding manufacturing procedures integrated circuits (ICS) have undergon October 10, 2006
An inventive method in an integrated circuit (IC) manufacturing process for using data regarding repair procedures conducted on IC's at probe to determine whether any further repairs will be conducted later in the manufacturing process includes storing the data in association with a
7115495 Methods of making projected contact structures for engaging bumped semiconductor devices October 3, 2006
A bumped semiconductor device contact structure is disclosed including at least one non-planar contact pad having a plurality of projections extending therefrom for contacting at least one solder ball of a bumped integrated circuit (IC) device, such as a bumped die and a bumped packa
7109059 Methods for stacking wire-bonded integrated circuit dice on flip-chip bonded integrated circuit September 19, 2006
An inventive electronic device, such as a multi-chip module (MCM), a Single In-line Memory Module (SIMM), or a Dual In-line Memory Module (DIMM), includes a base, such as a printed circuit board, having a surface on which flip-chip pads and wire-bondable pads are provided. The flip-c
7060526 Wafer level methods for fabricating multi-dice chip scale semiconductor components June 13, 2006
A semiconductor component includes a base die and a secondary die stacked on and bonded to the base die. The base die includes conductive vias which form an internal signal transmission system for the component, and allow the circuit side of the secondary die to be bonded to the back sid
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