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Inventor:
Vaskelis; Algirdas
Address:
Vilnius, LT
No. of patents:
5
Patents:












Patent Number Title Of Patent Date Issued
7988774 Electroless deposition of cobalt alloys August 2, 2011
Systems and methods for electroless deposition of a cobalt-alloy layer on a copper surface include a solution characterized by a low pH. This solution may include, for example, a cobalt(II) salt, a complexing agent including at least two amine groups, a pH adjuster configured to adjust
7794530 Electroless deposition of cobalt alloys September 14, 2010
Systems and methods for electroless deposition of a cobalt-alloy layer on a copper surface include a solution characterized by a low pH. This solution may include, for example, a cobalt(II) salt, a complexing agent including at least two amine groups, a pH adjuster configured to adjust
7682431 Plating solutions for electroless deposition of ruthenium March 23, 2010
An electroless ruthenium plating solution is disclosed herein. The solution includes a ruthenium source, a polyamino polycarboxylic acid complexing agent, a reducing agent, a stabilizing agent, and a pH-modifying substance. A method of preparing an electroless ruthenium plating solut
7306662 Plating solution for electroless deposition of copper December 11, 2007
An electroless copper plating solution is disclosed herein. The solution includes an aqueous copper salt component, an aqueous cobalt salt component, a triamine based complexing agent, and an acidic pH-modifying substance in an amount sufficient to make the electroless copper plating
7297190 Plating solutions for electroless deposition of copper November 20, 2007
An electroless copper plating solution is disclosed herein. The solution includes an aqueous copper salt component, an aqueous cobalt salt component, a polyamine-based complexing agent, a chemical brightener component, a halide component, and a pH-modifying substance in an amount suf










 
 
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