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Browse by: INVENTOR PATENT HOLDER PATENT NUMBER DATE
 
 
Inventor:
Usui; Tatehito
Address:
Niihari, JP
No. of patents:
7
Patents:




Patent Number Title Of Patent Date Issued
7169254 Plasma processing system and apparatus and a sample processing method January 30, 2007
A plasma processing apparatus having a sample stage disposed inside a vacuum chamber and a plate member disposed opposing to a sample which is placed on the sample stage and supplied with electric power. The sample is processed using a plasma generated between the sample stage and the
6967109 Process monitoring methods in a plasma processing apparatus, monitoring units, and a sample proc November 22, 2005
A method and apparatus for measuring a potential difference for plasma processing with a plasma processing apparatus that processes a sample by introducing a gas into a vacuum chamber and generates plasma. A light-emitting portion is formed on a measurement-use sample of the sample t
6923885 Plasma processing system and apparatus and a sample processing method August 2, 2005
A plasma processing apparatus having a sample bench located in a vacuum chamber, a structure disposed at a position opposed to a sample placed on the sample bench and facing a plasma generated in the vacuum chamber, and at least one through-hole disposed in the structure through which a
6759253 Process monitoring methods in a plasma processing apparatus, monitoring units, and a sample proc July 6, 2004
The intensity of the light emitted from the light-emitting diode on wafer is measured and then the potential difference between the terminals of the light-emitting element, and the plasma current flowing thereinto are derived from measured light intensity. Since the use of a camera enabl
6755932 Plasma processing system and apparatus and a sample processing method June 29, 2004
The object of the present invention is to provide a plasma processing apparatus wherein plasma is generated in process chamber to treat a sample. Said plasma processing apparatus is further characterized in that multiple closely packed through-holes are formed on the plate installed on
6503364 Plasma processing apparatus January 7, 2003
In the plasma processing apparatus for generating plasma in a processing chamber and processing a wafer by mutual action of electromagnetic waves radiated from a UHF band antenna installed in the processing chamber and a magnetic field formed by a magnetic field generator installed aroun
6427621 Plasma processing device and plasma processing method August 6, 2002
In the plasma processing device for supplying electromagnetic waves to the first plate, generating plasma in the vacuum atmosphere between the first plate and the second plate which is arranged opposite to it, and processing the board loaded on the second plate, wherein the dielectric


 
 
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