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Browse by: INVENTOR PATENT HOLDER PATENT NUMBER DATE
 
 
Inventor:
Usami; Mitsuo
Address:
Akishima, JP
No. of patents:
23
Patents:












Patent Number Title Of Patent Date Issued
7159241 Method for the determination of soundness of a sheet-shaped medium, and method for the verificat January 2, 2007
The present invention provides a service system using a certificate which is easily portable and difficult to counterfeit. The feature of the invention is to use a contactless IC chip as a portable certificate. An IC chip-attached seal is thin and small, and therefore is easily portable
7119662 Service system, information processing system and interrogator October 10, 2006
A contactless IC chip is mounted or adhered on a certificate and used in a service system having an interrogator and a computer system. The interrogator and the computer system are interconnected via a network such as the Internet. The IC chip is used as an electronic tag and the int
7051205 Sheet-shaped medium, method and apparatus for determination of genuineness or counterfeitness of May 23, 2006
The present invention provides a service system using a certificate which is easily portable and difficult to counterfeit. The feature of the invention is to use a contactless IC chip as a portable certificate. An IC chip-attached seal is thin and small, and therefore is easily portable
6589818 Method for mounting a thin semiconductor device July 8, 2003
A semiconductor chip (105') and a substrate (102) are bonded with an organic adhesive layer (409) containing conductive particles (406), and a pad (405) and an electrode (412) are mutually, electrically connected through the conductive particles (406). The semiconductor chip (105') is
6514796 Method for mounting a thin semiconductor device February 4, 2003
A semiconductor chip (105') and a substrate (102) are bonded with an organic adhesive layer (409) containing conductive particles (406), and a pad (405) and an electrode (412) are mutually, electrically connected through the conductive particles (406).The semiconductor chip (105') is for
6486541 Semiconductor device and fabrication method November 26, 2002
A thin-film semiconductor device comprising at least a semiconductor element and a wiring is disclosed. A thin film of a protective insulating material is formed on the lower surface of the semiconductor element, and a substrate is bonded on the lower surface of the thin film. A method f
6440773 Semiconductor device August 27, 2002
An IC card strong against bending and with a thin semiconductor chip mounted thereon is disclosed which is further provided with a reinforcing plate to reduce damage of the semiconductor chip caused by a point pressure. The IC card is employable even under a mechanically severe envir
6379998 Semiconductor device and method for fabricating the same April 30, 2002
A process of contacting sides of a plurality of chips having semiconductor elements formed in a substrate surface, directly to each other on the same {111} crystal plane.
6291877 Flexible IC chip between flexible substrates September 18, 2001
A thin-film semiconductor device comprising at least a semiconductor element and a wiring is disclosed. A thin film of a protective insulating material is formed on the lower surface of the semiconductor element, and a substrate is bonded on the lower surface of the thin film. A method f
6239483 Semiconductor device May 29, 2001
Condenser (114), coil (115) and thin-thickness integrated circuit (312) are placed between the upper cover sheet (117) and the lower cover sheet (118), and adhesive (119) is filled into the space among them, whereby a card is fabricated. Because condenser (114), coil (115) and thin-thick
6166911 Semiconductor integrated circuit card assembly December 26, 2000
Provided is a semiconductor assembly, comprising a circuit board (1) including a conductor circuit (4), the conductor circuit including connecting pads, a semiconductor chip (2) provided with connecting terminals provided on a first surface thereof, and mounted on the circuit board,
6162701 Semiconductor device and method for making same December 19, 2000
A semiconductor chip (105') and a substrate (102) are bonded with an organic adhesive layer (409) containing conductive particles (406), and a pad (405) and an electrode (412) are mutually, electrically connected through the conductive particles (406).The semiconductor chip (105') is for
6140697 Semiconductor device October 31, 2000
Condenser (114), coil (115) and thin-thickness integrated circuit (312) are placed between the upper cover sheet (117) and the lower cover sheet (118), and adhesive (119) is filled into the space among them, whereby a card is fabricated. Because condenser (114), coil (115) and thin-thick
6051877 Semiconductor device and fabrication method April 18, 2000
A thin-film semiconductor device comprising at least a semiconductor element and a wiring is disclosed. A thin film of a protective insulating material is formed on the lower surface of the semiconductor element, and a substrate is bonded on the lower surface of the thin film. A method f
5986341 Semiconductor device November 16, 1999
A condenser, a coil and a thin-thickness integrated circuit are placed between an upper cover sheet and a lower cover sheet, and adhesive is filled into the space between them, whereby a card is fabricated. Because the condenser, the coil and the thin-thickness integrated circuit are
5909052 Semiconductor device having plural chips with the sides of the chips in face-to-face contact wit June 1, 1999
Prevention of reduction in the production yield due to the increase in the area of a semiconductor chip permits a sophisticated-performance single-chip semiconductor device to be fabricated. This also permits a many-kind small-amount production of semiconductor devices to be implemen
5893746 Semiconductor device and method for making same April 13, 1999
A semiconductor chip (105') and a substrate (102) are bonded with an organic adhesive layer (409) containing conductive particles (406), and a pad (405) and an electrode (412) are mutually, electrically connected through the conductive particles (406).The semiconductor chip (105') is for
5870289 Chip connection structure having diret through-hole connections through adhesive film and wiring February 9, 1999
A structure for connecting an integrated circuit chip to a wiring substrate which implements high-density packaging, high-density connection, high-speed signal transmission, and low cost. An integrated circuit is connected to a wiring substrate by means of flip-chip die bonding using an
5689136 Semiconductor device and fabrication method November 18, 1997
A thin-film semiconductor device comprising at least a semiconductor element and a wiring is disclosed. A thin film of a protective insulating material is formed on the lower surface of the semiconductor element, and a substrate is bonded on the lower surface of the thin film. A method f
5391501 Method for manufacturing integrated circuits with a step for replacing defective circuit element February 21, 1995
A method for manufacturing a semiconductor integrated circuit device is described. The method comprises forming a plurality of macrocells each comprising a semiconductor integrated circuit on a semiconductor layer of an SOI (silicon on insulator) substrate, subjecting an insulating film
5296755 High speed BI CMOS logic circuit and a semiconductor integrated circuit device using same March 22, 1994
Herein disclosed is a logic circuit which has an input bipolar transistor for receiving an input signal at its base; variable impedance circuit having at least a first P-channel MOSFET connected between a first supply voltage and the collector of the input bipolar transistor; a second
5208178 Manufacturing a semiconductor integrated circuit device having on chip logic correction May 4, 1993
The present invention relates to a logic correction for a random logic IC of a high integration density, and more particularly to an on-chip logic correction method wherein the upper surface of a chip is divided into a large number of macrocells, testing of the macrocells is made and eac
5206546 Logic circuit including variable impedance means April 27, 1993
A SPL (or Super Push-pull Logic) circuit is provided which includes: a first variable resistor circuit connected between the collector of an input transistor and a first supply voltage terminal (GND) a second variable resistor circuit connected between the emitter of the input transi










 
 
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