A method of producing a printed wiring board comprising innerlayer conductor circuits among insulating layers and blind via-holes formed by irradiating laser beams from the outermost surface of the insulating layer toward the innerlayer conductor circuit. A central portion of the inn
In the production of a printed wiring board comprising innerlayer conductor circuits 161, 131 arranged among insulating layers 101.about.103 and blind via-holes 141, 142 formed from an outermost surface of the insulating layer toward the innerlayer conductor circuit, an opening hole 160
