Resources Contact Us Home
Ueno; Tomikazu
Yokkaichi, JP
No. of patents:

Patent Number Title Of Patent Date Issued
8157877 Chemical mechanical polishing aqueous dispersion, chemical mechanical polishing method, and kit April 17, 2012
A chemical mechanical polishing aqueous dispersion includes (A) abrasive grains having a pore volume of 0.14 ml/g or more, and (B) a dispersion medium.
8128464 Chemical mechanical polishing pad March 6, 2012
A chemical mechanical polishing pad used for chemical mechanical polishing comprises a polishing surface, a non-polishing surface that is provided opposite to the polishing surface, a side surface that connects an outer edge of the polishing surface and an outer edge of the non-polis

  Recently Added Patents
Scale information for drawing annotations
Terminal box assembly
Mirror drift compensation in an optical circuit switch
Image forming apparatus and system connectable with an authorization apparatus via a communications network, the image forming apparatus comprising an apparatus control section, an initial inq
Print system
Owner-brokered knowledge sharing machine
Partial response decision feedback equalizer with distributed control
  Randomly Featured Patents
Phase control system for polarized synchronous motors
Use of GABA-B selective agonists as anti-tussive agents
Spherical robotic shoulder joint
Pharmaceutical composition and method for inhibiting hair growth by administration of activin or activin agonists
Shawl blanket with feet pockets
Image blur prevention apparatus and a contact portion for contacting fixed portions of a movable optical member for an image blur prevention apparatus which prevents image blur by moving the m
Digital FM demodulation apparatus demodulating sampled digital FM modulated wave
Pre-charging display apparatus
Adaptive seat belt tensioning system
Disubstituted chalcone oximes having RAR.gamma. retinoid receptor antagonist activity