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Ueno; Tomikazu
Yokkaichi, JP
No. of patents:

Patent Number Title Of Patent Date Issued
8157877 Chemical mechanical polishing aqueous dispersion, chemical mechanical polishing method, and kit April 17, 2012
A chemical mechanical polishing aqueous dispersion includes (A) abrasive grains having a pore volume of 0.14 ml/g or more, and (B) a dispersion medium.
8128464 Chemical mechanical polishing pad March 6, 2012
A chemical mechanical polishing pad used for chemical mechanical polishing comprises a polishing surface, a non-polishing surface that is provided opposite to the polishing surface, a side surface that connects an outer edge of the polishing surface and an outer edge of the non-polis

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