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Inventor: Ueda; Yutaka
Address: Mitaka, JP
No. of patents: 3
Patents:
| Patent Number |
Title Of Patent |
Date Issued |
| 7129507 |
Chip mis-position detection method |
October 31, 2006 |
| The invention is a method for detecting float or peel of semiconductor chips arranged in X and Y axes directions diced and bonded to a dicing tape on a stage. The method includes detecting float or peel of the semiconductor chips in a respective horizontal or longitudinal row arrange |
| 7126145 |
Frame transfer prober |
October 24, 2006 |
| A frame transfer prober 1, for carrying out an electrical property test on a number of semiconductor chips 10 fixed on a dicing tape 11, comprises a separation detection unit 9 for detecting the separation and/or protrusion of the semiconductor chips 10 from the dicing tape. The sepa |
| 7119560 |
Probe apparatus |
October 10, 2006 |
| A probe apparatus 1 includes displacement detection means 6 disposed on a surface 4a of a probe card 4 from which probing needles 41 of the probe card 4 protrude, and control means 5 for receiving a signal of a positional change of the probe card 4 from the displacement detection mea |
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