Resources Contact Us Home
Browse by: INVENTOR PATENT HOLDER PATENT NUMBER DATE
 
 
Inventor:
Udell; Kent S.
Address:
Berkeley, CA
No. of patents:
2
Patents:












Patent Number Title Of Patent Date Issued
5986159 Chemical tailoring of steam to remediate underground mixed waste contaminents November 16, 1999
A method to simultaneously remediate mixed-waste underground contamination, such as organic liquids, metals, and radionuclides involves chemical tailoring of steam for underground injection. Gases or chemicals are injected into a high pressure steam flow being injected via one or more
5018576 Process for in situ decontamination of subsurface soil and groundwater May 28, 1991
A method is provided for in situ decontamination of contaminated subsurface area by injection of steam into injection wells and withdrawing liquids and vapors from extraction wells under subatmospheric pressure whereby steam is passed through the contaminated area in an essentially horiz










 
 
  Recently Added Patents
Information processing apparatus and storage medium for storing information processing program
Automatic portable electronic device configuration
Magnetic disk and manufacturing method thereof
Semiconductor assembly and semiconductor package including a solder channel
Assay for the diagnosis of flaviviral infection using antibodies with high affinity for NS1 protein of flavivirusi in hexameric form
Enzymatic demethylation of flavonoids
Vacuum cleaner
  Randomly Featured Patents
Process exception list updating in a malware behavior monitoring program
Method of risk modeling by estimating frequencies of loss and loss distributions for individual risks in a portfolio
Read-only optical recording medium and disc cartridge
Rate adaptive pacemaker with adjustment of sensor rate as a function of sensed sinus rate
Chair
Steroids as neurochemical stimulators of the VNO to alleviate pain
Footwear portion
Floating steering axle
Combination downflow-upflow vapor-liquid separator
Method of transferring patterned non-densely packed interfacial particle films onto substrates