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Inventor: Uang; Ruoh-Huey
Address: Taoyuan Hsien, TW
No. of patents: 1
Patents:
| Patent Number |
Title Of Patent |
Date Issued |
| 7163885 |
Method of migrating and fixing particles in a solution to bumps on a chip |
January 16, 2007 |
| A method for dispersing and fixing particles on the bumps of a chip using an electrophoresis technology is provided. The particles and chip bumps are processed to carry charges by applying chemical bonding between metal and thiol with electric charges. The chip is placed in a reactor wit |
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