| |
|
Inventor: Uang; Ruoh-Huey
Address: Taipei, TW
No. of patents: 2
Patents:
| Patent Number |
Title Of Patent |
Date Issued |
| 6539624 |
Method for forming wafer level package |
April 1, 2003 |
| A method for forming a wafer level package that is equipped with solder balls on a top surface and encapsulated by a stress buffer layer of an elastomeric material is disclosed. The method can be carried by first forming a plurality of solder balls on bond pads provided on a top surface |
| 6440836 |
Method for forming solder bumps on flip chips and devices formed |
August 27, 2002 |
| The present invention discloses a dual-photoresist method for forming fine-pitched solder bumps on flip chips by utilizing two separate layers of photoresist, i.e., a first thin photoresist layer for patterning the BLM layers on top of the aluminum bonding pads and a second thick pho |
|
|
|
