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Inventor: Uang; Ruoh-Huey
Address: Hsinchu, TW
No. of patents: 2
Patents:
| Patent Number |
Title Of Patent |
Date Issued |
| 6268114 |
Method for forming fine-pitched solder bumps |
July 31, 2001 |
| A method for forming solder balls that have larger spacings between them and electronic devices containing such solder balls are disclosed. In the method, an additional layer of a leachable metal such as gold or silver is used between an under bump metallurgy layer and a solder bump subs |
| 6179200 |
Method for forming solder bumps of improved height and devices formed |
January 30, 2001 |
| A method for forming solder balls that have improved height on an electronic substrate such as a silicon wafer and devices formed are disclosed. In the method, after solder bumps are deposited by a conventional method such as evaporation, electroplating, electroless plating or solder |
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