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Inventor: Uang; Ruoh-Huey
Address: Hsin-Dian, TW
No. of patents: 1
Patents:
| Patent Number |
Title Of Patent |
Date Issued |
| 6989325 |
Self-assembled nanometer conductive bumps and method for fabricating |
January 24, 2006 |
| A self-assembled nanometer conductive bump and a method for fabricating the bump. In the method, a multiplicity of carbon nanotubes that are coated at two ends with chemically functional groups is first provided. A substrate that is equipped with at least one bond pad on a surface is |
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