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Inventor: Uang; Rouh Huey
Address: Hsinchu, TW
No. of patents: 1
Patents:
| Patent Number |
Title Of Patent |
Date Issued |
| 7479702 |
Composite conductive film and semiconductor package using such film |
January 20, 2009 |
| A composite conductive film and a semiconductor package using such film are provided. The composite conductive film is formed of a polymer-matrix and a plurality of nano-sized conductive lines is provided. The composite conductive film has low resistance, to connect between a fine-pitch |
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