| Patent Number |
Title Of Patent |
Date Issued |
| 5587336 |
Bump formation on yielded semiconductor dies |
December 24, 1996 |
| The ball bump structure of the subject invention provides a hermetically sealed bond pad at the surface of a semiconductor chip. An adhesion pad is formed at the surface of the bond pad. The adhesion pad includes a barrier layer, preferably a titanium/tungsten alloy, and a bonding layer, |
| 5342495 |
Structure for holding integrated circuit dies to be electroplated |
August 30, 1994 |
| A method of forming conductive bumps on the bond pads of one or more ICs is described wherein a barrier metal layer such as TiW is first formed over the bond pads in order to passivate the surface of the one or more ICs, an electroplatable base comprising an adhesion metal layer is then |
| 5072075 |
Double-sided hybrid high density circuit board and method of making same |
December 10, 1991 |
| A very fine line three-dimensional package is constructed without lamination during construction of the signal core. Construction of the signal core employs a method of line and hole formation and planarization without drilling, and avoids imposing excessive stress on the package dur |
| 4692839 |
Multiple chip interconnection system and package |
September 8, 1987 |
| A multiple chip interconnection system and package for interconnecting and cooling integrated circuits includes an electrically-conductive plate 10 having an upper surface 12. On the upper surface 12, a first layer of polyimide 16 or other electrically-insulating material is deposited. O |
