| Patent Number |
Title Of Patent |
Date Issued |
| 7612295 |
Printed wiring board and method for manufacturing the same |
November 3, 2009 |
| In a printed wiring board, an odd number (n) of conductive layers (11-13) and insulating layers (21-23) are alternately laminated upon another. The first conductive layer (11) is constituted as a parts connecting layer and the n-th conductive layer (13) is constituted as an external |
| 7594320 |
Method of manufacturing printed wiring board |
September 29, 2009 |
| A solder resist comprising a thermosetting resin is printed on a surface of an insulating board (7) having a conductor circuit (6). The solder resist is then heat-cured to form an insulating film (1) having a low thermal expansion coefficient. A laser beam (2) is then applied to the |
| 7568922 |
Printed wiring board having a solder pad and a method for manufacturing the same |
August 4, 2009 |
| This invention provides a printed wiring board having an intensified drop impact resistance of a joint portion between pad and solder. An electrode pad comprises pad portion loaded with solder ball and a cylindrical portion projecting to the solder ball supporting the pad portion. An |
| 7552531 |
Method of manufacturing a printed wiring board having a previously formed opening hole in an inn |
June 30, 2009 |
| A method of producing a printed wiring board comprising innerlayer conductor circuits among insulating layers and blind via-holes formed by irradiating laser beams from the outermost surface of the insulating layer toward the innerlayer conductor circuit. A central portion of the inn |
| 7453702 |
Printed wiring board |
November 18, 2008 |
| A printed wiring board comprises the insulating layer 11 (12); at least one resistance element 31.sub.1 (31.sub.2) comprising a metal as a main component has 0.5 to 5 .mu.m of a roughened surface in an arithmetic means height in the one surface, in -Z direction, and 5% to 50% of the |
| 7339118 |
Printed wiring board and method for manufacturing the same |
March 4, 2008 |
| In a printed wiring board, an odd number (n) of conductive layers (11-13) and insulating layers (21-23) are alternately laminated upon each other. The first conductive layer (11) is a parts connecting layer and the n-th conductive layer (13) is an external connecting layer which is conne |
| 7310238 |
Thin-film embedded capacitance, method for manufacturing thereof, and a printed wiring board |
December 18, 2007 |
| The present invention provides a thin-film embedded capacitance having a substantial electrostatic capacity per unit area, and a method for manufacturing thereof.A thin film embedded capacitance comprising: a metallic thin-film for wiring made of a metallic material in a non-yield st |
| 6986917 |
Printed wiring board and method of manufacturing the same |
January 17, 2006 |
| A solder resist comprising a thermosetting resin is printed on a surface of an insulating board (7) having a conductor circuit (6). The solder resist is then heat-cured to form an insulating film (1) having a low thermal expansion coefficient. A laser beam (2) is then applied to the |
| 6809415 |
Printed-circuit board and method of manufacture thereof |
October 26, 2004 |
| A printed circuit board 1 providing superior adhesion between a substrate 2 and a conductor pattern 3 and preventing damage of the substrate 2. The width c of the bottom surface 310 of the conductor pattern 3 is greater than the width d of the top surface 320. Accordingly, the conductor |
| 6715204 |
Printed wiring board and method for producing the same |
April 6, 2004 |
| A printed circuit board and a method for manufacturing the same that facilitates the formation of an upper surface pattern and prevents a lower surface metal foil from being damaged when forming a blind via hole with a laser. A lower surface and an upper surface of an insulative substrat |
| 6590165 |
Printed wiring board having throughole and annular lands |
July 8, 2003 |
| In the production of a printed wiring board comprising innerlayer conductor circuits 161, 131 arranged among insulating layers 101.about.103 and blind via-holes 141, 142 formed from an outermost surface of the insulating layer toward the innerlayer conductor circuit, an opening hole 160 |
| 6555208 |
Printed wiring board and method of manufacturing the same |
April 29, 2003 |
| A solder resist comprising a thermosetting resin is printed on a surface of an insulating board (7) having a conductor circuit (6). The solder resist is then heat-cured to form an insulating film (1) having a low thermal expansion coefficient. A laser beam (2) is then applied to the port |
| 6284353 |
Printed wiring board and method of manufacturing the same |
September 4, 2001 |
| A solder resist comprising a thermosetting resin is printed on a surface of an insulating board (7) having a conductor circuit (6). The solder resist is then heat-cured to form an insulating film (1) having a low thermal expansion coefficient. A laser beam (2) is then applied to the port |
| 6228466 |
Printed wiring board and method for manufacturing the same |
May 8, 2001 |
| A printed wiring board which has a conductor circuit (12) on an insulating substrate (10) and a surface insulating layer (14) formed on the surface of the substrate (10) including the surface of the conductor circuit (12). Part of the conductor circuit (12) has an exposed conductor secti |
| 4993481 |
Thermal storage unit |
February 19, 1991 |
| A thermal storage unit has a thermal storage material which performs heat exchange through a fluid filled in a thermal storage body arranged within a vessel having an opening communicated to outside. The thermal storage body is a porous ceramic molding which contains the thermal storage |
| 4913738 |
Heat-resistant composite body |
April 3, 1990 |
| A heat-resistant composite body comprising a composite body of silicon carbide and metallic silicon, the metallic silicon existing in the porous silicon carbide sintered body. The silicon carbide particles constituting the silicon carbide sintered carbide sintered body have an average |
| 4846673 |
Process for preparing heat-resistant composite body |
July 11, 1989 |
| A process for preparing a heat-resistant composite body, comprising forming silicon carbide crystal powder into a molded product, sintering the molded product in a non-oxidizing atmosphere, and thereafter filling with metallic silicon the inside of permeable voids of said porous body |
