| |
|
Inventor: Tsujisawa; Takafumi
Address: Osaka, JP
No. of patents: 1
Patents:
| Patent Number |
Title Of Patent |
Date Issued |
| 7552528 |
Wafer expanding device, component feeder, and expanding method for wafer sheet |
June 30, 2009 |
| In slack removal processing for removing slack generated on a wafer sheet by heating blow, a wafer feeding plate is positioned at a height position between a first height position and a second height position. This makes it possible to decrease a gap between an upper end portion of an |
|
|
|
