| Patent Number |
Title Of Patent |
Date Issued |
| 7553680 |
Methods to provide and expose a diagnostic connector on overmolded electronic packages |
June 30, 2009 |
| An overmolded electronic assembly is provided having a circuit board with electronic devices and a diagnostic connection. The diagnostic connection includes electrical conductors having a distal end projecting above a first side of the circuit board, for example, circuit pads having sold |
| 7352070 |
Polymer encapsulated electrical devices |
April 1, 2008 |
| Improved encapsulated, overmolded and/or underfilled electrical components having a complete encapsulation, overmolding and/or underfilling with a coefficient of thermal expansion that is uniform and substantially free of gradients includes a polymeric matrix and an inorganic filler havi |
| 7268429 |
Technique for manufacturing an overmolded electronic assembly |
September 11, 2007 |
| A technique for manufacturing an electronic assembly uses a mold that has a first mold portion and a second mold portion. The first mold portion includes a plurality of spaced mold pins extending from an inner surface. A cavity of the first and second mold portions provides a mold cavity |
| 7202571 |
Electronic module with form in-place pedestal |
April 10, 2007 |
| An electronic module includes a substrate, at least one surface mounted integrated circuit (IC) component and an underfill material. The substrate includes a plurality of electrically conductive traces, formed on at least one surface of the substrate, and the component is electricall |
| 6807731 |
Method for forming an electronic assembly |
October 26, 2004 |
| An overmolded electronic assembly having an electromagnetic interference shield, in the form of a thin metal film or foil, coupled to the top of or within an overmolded body. The shield effectively reduces the amount of electromagnetic interference ("EMI") emissions from penetrating with |
| 6693239 |
Overmolded circuit board with underfilled surface-mount component and method therefor |
February 17, 2004 |
| An overmolded circuit board assembly and a method for forming the assembly. The assembly and method entail overmolding both surfaces of a circuit board and underfilling at least one surface-mount circuit device attached to at least one surface of the board with solder bump connections, w |
