Resources Contact Us Home
Toyama; Kohei
Fukushima-ken, JP
No. of patents:

Patent Number Title Of Patent Date Issued
6387809 Method and apparatus for lapping or polishing semiconductor silicon single crystal wafer May 14, 2002
A method and apparatus for lapping or polishing a semiconductor silicon single crystal wafer is provided for eliminating the transfer of waviness of a wafer cut by a wire saw apparatus, improving the quality of the wafer, realizing automated lapping or polishing processes, allowing for
5693596 Cutting fluid, method for production thereof, and method for cutting ingot December 2, 1997
A water-soluble cutting fluid is produced by dissolving a polymer fatty acid triglyceride imidazole, 2-methyl-1-stearate, and boric acid imidazole in the dispersion of inorganic bentonite in water thereby preparing a main component and adding oleic acid (agent for enhancing the lubricity

  Recently Added Patents
Semiconductor device element formed on SOI substrate comprising a hollow region, and having capacitors in an electric field alleviation region
Playback device, playback method, and computer program
Sample holder and method for treating sample material
Video surveillance system employing video primitives
Voltage detecting device for LED driver
Manufactured product configuration
Method for transmitting an electronic short message to multiple receivers
  Randomly Featured Patents
Control system for a fluid drive
Electronic module with form in-place pedestal
Apparatus and method for driving an optical disc with a caddy having a cover
Artificial antibodies, method of producing the same and use thereof
Apparatus comprising voltage multiplication components
Phase error detector
Portable telephone handset
Selectively reinforced flexible tape carrier packages for liquid crystal display modules
Means for controlling fluid flow
Method for processing a silver halide photographic light-sensitive material