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Toyama; Kohei
Fukushima-ken, JP
No. of patents:

Patent Number Title Of Patent Date Issued
6387809 Method and apparatus for lapping or polishing semiconductor silicon single crystal wafer May 14, 2002
A method and apparatus for lapping or polishing a semiconductor silicon single crystal wafer is provided for eliminating the transfer of waviness of a wafer cut by a wire saw apparatus, improving the quality of the wafer, realizing automated lapping or polishing processes, allowing for
5693596 Cutting fluid, method for production thereof, and method for cutting ingot December 2, 1997
A water-soluble cutting fluid is produced by dissolving a polymer fatty acid triglyceride imidazole, 2-methyl-1-stearate, and boric acid imidazole in the dispersion of inorganic bentonite in water thereby preparing a main component and adding oleic acid (agent for enhancing the lubricity

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