Resources Contact Us Home
Toyama; Kohei
Fukushima-ken, JP
No. of patents:

Patent Number Title Of Patent Date Issued
6387809 Method and apparatus for lapping or polishing semiconductor silicon single crystal wafer May 14, 2002
A method and apparatus for lapping or polishing a semiconductor silicon single crystal wafer is provided for eliminating the transfer of waviness of a wafer cut by a wire saw apparatus, improving the quality of the wafer, realizing automated lapping or polishing processes, allowing for
5693596 Cutting fluid, method for production thereof, and method for cutting ingot December 2, 1997
A water-soluble cutting fluid is produced by dissolving a polymer fatty acid triglyceride imidazole, 2-methyl-1-stearate, and boric acid imidazole in the dispersion of inorganic bentonite in water thereby preparing a main component and adding oleic acid (agent for enhancing the lubricity

  Recently Added Patents
Latch-up free ESD protection
Active tags
Composite high reflectivity layer
Method of treating lung cancer
Vending machine
Synchronization of web applications and media
Light fitting
  Randomly Featured Patents
Walk-behind self-propelled working machine
Tire tread
Spinal cage having deployable member
Programmable mobile device with thumb wheel
Method and apparatus for sensing air flow into a cylinder of internal combustion engine and method and apparatus for controlling fuel of the internal combustion engine arranged to use the meth
Pivot hinge for portable computers
Truck acoustic data analyzer system
Flow component for medical infusion/transfusion lines
Transmission line using a power combiner for high data rate communication in a computerized tomography system
Spin extractor