Resources Contact Us Home
Toyama; Kohei
Fukushima-ken, JP
No. of patents:

Patent Number Title Of Patent Date Issued
6387809 Method and apparatus for lapping or polishing semiconductor silicon single crystal wafer May 14, 2002
A method and apparatus for lapping or polishing a semiconductor silicon single crystal wafer is provided for eliminating the transfer of waviness of a wafer cut by a wire saw apparatus, improving the quality of the wafer, realizing automated lapping or polishing processes, allowing for
5693596 Cutting fluid, method for production thereof, and method for cutting ingot December 2, 1997
A water-soluble cutting fluid is produced by dissolving a polymer fatty acid triglyceride imidazole, 2-methyl-1-stearate, and boric acid imidazole in the dispersion of inorganic bentonite in water thereby preparing a main component and adding oleic acid (agent for enhancing the lubricity

  Recently Added Patents
Method and system for remote delivery of email
Format for providing traffic information and a method and apparatus for using the format
Integrated circuit devices having conductive structures with different cross sections
Vacuum cleaner filter adapter ring
Display device and projector
Phase-amplitude 3-D stereo encoder and decoder
Spread spectrum communication system and transmission power control method therefor
  Randomly Featured Patents
Induction heating core for adhesive fastening systems
Utility knife
Novel particulate expandable styrene polymers having short minimum molding times and method for preparing same
Mechanical sequencing system for firing photoflash lamps
Stand of a display device
Plants and seeds of hybrid corn variety CH431778
Information processing device with an acceleration sensor
Process for the manufacture of a crossbeam for motor vehicles and the respective crossbeam
Cap assembly for a high current capacity energy delivery device
Method and apparatus for treatment of viral diseases