Resources Contact Us Home
Browse by: INVENTOR PATENT HOLDER PATENT NUMBER DATE
 
 
Inventor:
Toyama; Kohei
Address:
Fukushima-ken, JP
No. of patents:
2
Patents:












Patent Number Title Of Patent Date Issued
6387809 Method and apparatus for lapping or polishing semiconductor silicon single crystal wafer May 14, 2002
A method and apparatus for lapping or polishing a semiconductor silicon single crystal wafer is provided for eliminating the transfer of waviness of a wafer cut by a wire saw apparatus, improving the quality of the wafer, realizing automated lapping or polishing processes, allowing for
5693596 Cutting fluid, method for production thereof, and method for cutting ingot December 2, 1997
A water-soluble cutting fluid is produced by dissolving a polymer fatty acid triglyceride imidazole, 2-methyl-1-stearate, and boric acid imidazole in the dispersion of inorganic bentonite in water thereby preparing a main component and adding oleic acid (agent for enhancing the lubricity










 
 
  Recently Added Patents
Systems and methods for dissipating an electric charge while insulating a structure
Polarization preserving front projection screen microstructures
Method and device for evaluating evolution of tumoural lesions
Image processing apparatus and method configured to calculate defocus amount of designated area
Processing financial documents
Taxi cab key chain
Sheet coil type resolver
  Randomly Featured Patents
Filter
Balloon catheter with manually operated valve and aspirator
Device for preventing falling of persons between pool cover and pool wall
Semiconductor device and manufacturing the same
Lemon squeezer
Cooling assembly for metallurgical vessels
Breaker press with multiple pistons particulary for urban waste-materials
Gesture synthesizer for electronic sound device
Physical layer repeater utilizing real time measurement metrics and adaptive antenna array to promote signal integrity and amplification
Knotless tissue anchor