Resources Contact Us Home
Toyama; Kohei
Fukushima-ken, JP
No. of patents:

Patent Number Title Of Patent Date Issued
6387809 Method and apparatus for lapping or polishing semiconductor silicon single crystal wafer May 14, 2002
A method and apparatus for lapping or polishing a semiconductor silicon single crystal wafer is provided for eliminating the transfer of waviness of a wafer cut by a wire saw apparatus, improving the quality of the wafer, realizing automated lapping or polishing processes, allowing for
5693596 Cutting fluid, method for production thereof, and method for cutting ingot December 2, 1997
A water-soluble cutting fluid is produced by dissolving a polymer fatty acid triglyceride imidazole, 2-methyl-1-stearate, and boric acid imidazole in the dispersion of inorganic bentonite in water thereby preparing a main component and adding oleic acid (agent for enhancing the lubricity

  Recently Added Patents
Dual source mass spectrometry system
Sampling switch circuit that uses correlated level shifting
Metal melting apparatus and method for melting metal
Systems and methods for archiving and retrieving navigation points in a voice command platform
Late loading rich media
Performance apparatus, a method of controlling the performance apparatus and a program recording medium
Power management method for reducing power of host when turning off main monitor and computer system applying the same
  Randomly Featured Patents
Methods for enhanced aromatic extraction employing sulfone-sulfoxide compositions
Oil-dispersible antimony oxide sol dispersed as an oil in water emulsion into a cracking feed
Gas-barrier resin composition
Endless media filtration system
Control circuits for parallel optical interconnects
Animal training system with multiple configurable correction settings
Reinforcing assembly and reinforced structure using a reinforcing assembly
Computer system, data migration monitoring method and data migration monitoring program
Direct memory access method for use with a multiplexed data bus
Apparatus for producing blown synthetic-resin foils and films