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Inventor:
Tolles; Robert D.
Address:
Santa Clara, CA
No. of patents:
25
Patents:












Patent Number Title Of Patent Date Issued
7255632 Chemical mechanical polishing system having multiple polishing stations and providing relative l August 14, 2007
A polishing method usable in an apparatus including a rotatable member rotatable about a first axis, at least one substrate head assembly supported on said rotatable member, and at least two polishing surfaces arranged below said rotatable member at respective angular positions about
7238090 Polishing apparatus having a trough July 3, 2007
Methods and apparatus for chemical mechanical polishing are described. In one embodiment, an apparatus includes a table top and a transfer station and multiple polishing stations are mounted on the table top. The apparatus further includes multiple washing stations, where each washing
7097544 Chemical mechanical polishing system having multiple polishing stations and providing relative l August 29, 2006
An apparatus and associated methods for polishing semiconductor wafers and other workpieces that includes polishing surfaces located at multiple polishing stations. Multiple wafer heads, preferably at least one greater in number than the number of polishing stations, can be loaded with
6716092 Apparatus for making a polishing pad with a partial adhesive coating April 6, 2004
A method for selectively altering a polishing pad adhesive layer includes providing a mask having transparent regions and opaque regions and directing radiation toward the mask so that the radiation passes through the transparent regions and impinges onto the adhesive layer on the po
6702651 Method and apparatus for conditioning a polishing pad March 9, 2004
A polishing material for chemical mechanical polishing has a mesh of fibers and a binder material holding the fibers in the mesh. The binder material coalesced among the fibers to leave pores in the interstices between the fibers of the mesh. The fibers and binder material provide the po
6688957 Substrate polishing article February 10, 2004
A polishing material for chemical mechanical polishing has a mesh of fibers and a binder material holding the fibers in the mesh. The binder material coalesced among the fibers to leave pores in the interstices between the fibers of the mesh. The fibers and binder material provide the po
6623341 Substrate polishing apparatus September 23, 2003
A polishing material for chemical mechanical polishing has a mesh of fibers and a binder material holding the fibers in the mesh. The binder material coalesced among the fibers to leave pores in the interstices between the fibers of the mesh. The fibers and binder material provide the po
6592438 CMP platen with patterned surface July 15, 2003
A chemical mechanical polishing system is provided having one more polishing stations. The polishing stations include a platen and pad mounted to an upper surface of the platen. The upper surface of the platen is patterned to define a raised area and a recessed area. The raised area
6575825 CMP polishing pad June 10, 2003
A polishing pad for use in a chemical mechanical polishing system is provided. The pad is mounted to a rotatable platen and comprises a polishing surface and a deflection surface which provides a desired degree of rigidity and compliance to the pad when brought into contact with a su
6533645 Substrate polishing article March 18, 2003
A polishing material for chemical mechanical polishing has a mesh of fibers and a binder material holding the fibers in the mesh. The binder material coalesced among the fibers to leave pores in the interstices between the fibers of the mesh. The fibers and binder material provide the po
6527624 Carrier head for providing a polishing slurry March 4, 2003
A carrier head of a chemical mechanical polishing apparatus to apply and distribute a polishing slurry to a polishing pad. The retaining ring includes a trough and one or more channels to channel the polishing slurry to the polishing pad.
6443823 Carrier head with layer of conformable material for a chemical mechanical polishing system September 3, 2002
A carrier head for a chemical mechanical polishing apparatus. A layer of conformable material is disposed in a recess of the carrier head to provide a mounting surface for a substrate. The conformable material may be elastic and undergo normal strain in response to an applied load. The
6299516 Substrate polishing article October 9, 2001
A polishing layer for chemical mechanical polishing includes a frozen binder material solution which has a liquid state at room temperature, and solid particles dispersed in the frozen binder material. The solid particles may be abrasives, such as colloidal silica or alumina, and/or
6290589 Polishing pad with a partial adhesive coating September 18, 2001
A method for selectively altering a polishing pad adhesive layer includes providing a mask having transparent regions and opaque regions and directing radiation toward the mask so that the radiation passes through the transparent regions and impinges onto the adhesive layer on the po
6280297 Apparatus and method for distribution of slurry in a chemical mechanical polishing system August 28, 2001
Slurry is provided to the surface of the polishing pad by pumping the slurry up through a central port, or by dripping the slurry down onto the surface of the polishing pad from a slurry feed tube. A slurry wiper, which may have one or more flexible members, sweeps the slurry evenly and
6220942 CMP platen with patterned surface April 24, 2001
A chemical mechanical polishing system is provided having one more polishing stations. The polishing stations include a platen and pad mounted to an upper surface of the platen. The upper surface of the platen is patterned to define a raised area and a recessed area. The raised area
6217426 CMP polishing pad April 17, 2001
A polishing pad for use in a chemical mechanical polishing system is provided. The pad is mounted to a rotatable platen and comprises a polishing surface and a deflection surface which provides a desired degree of rigidity and compliance to the pad when brought into contact with a su
6126517 System for chemical mechanical polishing having multiple polishing stations October 3, 2000
An apparatus and associated methods for polishing semiconductor wafers and other workpieces that includes a polishing surfaces, such as pads mounted on respective platens, located at multiple polishing stations. Multiple wafer heads, preferably at least one greater in number than the num
6080046 Underwater wafer storage and wafer picking for chemical mechanical polishing June 27, 2000
A wafer storage and wafer transfer system adjunct to a multi-station chemical mechanical polishing system. Multiple wafers are brought to the system stored in a cassette. A claw member attached to an overhead arm picks up the cassette and deposits it in a water-filled tub next to the
6051499 Apparatus and method for distribution of slurry in a chemical mechanical polishing system April 18, 2000
Slurry is provided to the surface of the polishing pad by pumping the slurry up through a central port, or by dripping the slurry down onto the surface of the polishing pad from a slurry feed tube. A slurry wiper, which may have one or more flexible members, sweeps the slurry evenly and
6036587 Carrier head with layer of conformable material for a chemical mechanical polishing system March 14, 2000
A carrier head for a chemical mechanical polishing apparatus. A layer of conformable material is disposed in a recess of the carrier head to provide a mounting surface for a substrate. The conformable material may be elastic and undergo normal strain in response to an applied load. The
5899801 Method and apparatus for removing a substrate from a polishing pad in a chemical mechanical poli May 4, 1999
A chemical mechanical polishing apparatus has a platen with a cavity with an opening to the top surface of the platen. A polishing pad is located at an upper surface of the platen. A flexible membrane is positioned in the cavity to define a first and a second volume. A pressure source is
5804507 Radially oscillating carousel processing system for chemical mechanical polishing September 8, 1998
An apparatus for polishing semiconductor wafers and other workpieces that includes a polishing pads mounted on respective platens at multiple polishing stations. Multiple wafer heads, at least one greater in number than the number of polishing stations, can be loaded with individual
5738574 Continuous processing system for chemical mechanical polishing April 14, 1998
An apparatus for polishing semiconductor wafers and other workpieces that includes polishing pads mounted on respective platens at multiple polishing stations. Multiple wafer heads, at least one greater in number than the number of polishing stations, can be loaded with individual wa
5599423 Apparatus and method for simulating and optimizing a chemical mechanical polishing system February 4, 1997
Apparatus and concomitant method for simulating a chemical mechanical polishing (CMP) system containing a polishing pad, a chuck for supporting a substrate, a positioner for positioning the polishing pad with respect to the substrate, a chuck rotator for rotating the chuck, and a polishi










 
 
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