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Tilgner; Rainer
Munchen, DE
No. of patents:

Patent Number Title Of Patent Date Issued
6930383 Electronic component including a housing and a substrate August 16, 2005
The invention relates to an electronic component including a housing and a first substrate having at least one integrated circuit, a multiplicity of contact surfaces arranged in an arbitrary distribution on the surface of the first substrate. A second substrate forms a housing and is
6653732 Electronic component having a semiconductor chip November 25, 2003
An electronic component includes a semiconductor chip and/or a test structure. The semiconductor chip includes a multi-layer coating having at least one interconnect layer, at least one insulation layer, and at least one planarization layer. A method of producing the component is also

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