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Inventor:
Thompson; Jeffrey Scott
Address:
Wilmington, DE
No. of patents:
2
Patents:




Patent Number Title Of Patent Date Issued
7550179 Method of copper deposition from a supercritical fluid solution containing copper (I) complexes June 23, 2009
Methods of depositing a copper film onto the surface of a substrate from a supercritical solution containing copper-containing precursors having monoanionic bidentate and neutral monodentate ligands, which comprise contacting the substrate with the solution; heating the substrate to a
6939578 Volatile copper(II) complexes for deposition of copper films by atomic layer deposition September 6, 2005
The present invention relates to novel 1,3-diimine copper complexes and the use of 1,3-diimine copper complexes for the deposition of copper on substrates or in or on porous solids in an Atomic Layer Deposition process. This invention also provides a process for making amino-imines a


 
 
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