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Browse by: INVENTOR PATENT HOLDER PATENT NUMBER DATE
 
 
Inventor:
Thallner; Erich
Address:
St. Florian, AT
No. of patents:
11
Patents:












Patent Number Title Of Patent Date Issued
8586132 Device and method for coating a micro- and/or nano-structured structural substrate and coated st November 19, 2013
The present invention relates to a device and a method for coating a microstructured and/or nanostructured structured substrate. According to the present invention, the coating is performed in a vacuum chamber. The pressure level in the vacuum chamber is elevated during or after the
8212989 Device for transferring structures which are provided in a mask onto a substrate July 3, 2012
The invention concerns a device for transferring structures which are provided in a mask onto a substrate, with at least one illumination device, for homogeneous illumination of a section of the mask, and with a mask holding device, for holding a mask in a mask plane which is defined
8157615 Device and process for applying and/or detaching a wafer to/from a carrier April 17, 2012
The invention relates to a device for applying and/or detaching a wafer to/from a carrier with a deformable membrane which can be aligned parallel to the contact surface of the wafer, with one contact side for at least partial contact-making with the contact surface, deformation me
8157307 Handling device and handling method for wafers April 17, 2012
The invention relates to a handling device and to a handling method for wafers, in particular for wafers with a thickness of less than 100 .mu.m. According to the invention it is provided that an adhesive membrane is arranged so as to delimit at least one workspace, the volume of which c
8156981 Combination of a substrate and a wafer April 17, 2012
The invention pertains to a combination of a substrate (6) and a wafer (15), wherein the substrate (6) and the wafer (15) are arranged parallel to one another and bonded together with the aid of an adhesive layer (8) situated between the substrate (6) and the wafer (15), and wherein the
8142701 Method and device for producing a nanopatterned disc March 27, 2012
The invention relates to a method and a device according to the preambles of claims 1 and 10, and also to the use of a nanopatterned die, a disc with a defined nanopattern and a hard disk drive comprising a disc of this type. In order to propose a more rapidly operating device as well as
8118290 Method for holding wafers and device for fixing two parallel arranged wafers relative to one ano February 21, 2012
The invention relates to a device having a first holding instrument (1) for a first wafer (5) and having a second holding instrument (7) for a second wafer (9) arrangeable parallel to the first wafer (5), the two holding instruments (1, 7) being fixable relative to one another. Accor
8087708 Handling device and handling method for wafers January 3, 2012
The invention relates to a handling device and to a handling method for wafers, in particular for wafers with a thickness of less than 100 .mu.m. According to the invention it is provided that an adhesive membrane is arranged so as to delimit at least one workspace, the volume of which c
7909374 Handling device and handling method for wafers March 22, 2011
The invention relates to a handling device and to a handling method for wafers, in particular for wafers with a thickness of less than 100 .mu.m. According to the invention it is provided that an adhesive membrane is arranged so as to delimit at least one workspace, the volume of which c
7598152 Device and method for bonding wafers October 6, 2009
The invention relates to a device and a corresponding method for bonding wafers along their corresponding surfaces.
7246445 Alignment device July 24, 2007
The present invention relates to an alignment device for aligning an object in a plane.










 
 
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