| Patent Number |
Title Of Patent |
Date Issued |
| 8212989 |
Device for transferring structures which are provided in a mask onto a substrate |
July 3, 2012 |
| The invention concerns a device for transferring structures which are provided in a mask onto a substrate, with at least one illumination device, for homogeneous illumination of a section of the mask, and with a mask holding device, for holding a mask in a mask plane which is defined |
| 8157615 |
Device and process for applying and/or detaching a wafer to/from a carrier |
April 17, 2012 |
| The invention relates to a device for applying and/or detaching a wafer to/from a carrier with a deformable membrane which can be aligned parallel to the contact surface of the wafer, with one contact side for at least partial contact-making with the contact surface, deformation me |
| 8157307 |
Handling device and handling method for wafers |
April 17, 2012 |
| The invention relates to a handling device and to a handling method for wafers, in particular for wafers with a thickness of less than 100 .mu.m. According to the invention it is provided that an adhesive membrane is arranged so as to delimit at least one workspace, the volume of which c |
| 8156981 |
Combination of a substrate and a wafer |
April 17, 2012 |
| The invention pertains to a combination of a substrate (6) and a wafer (15), wherein the substrate (6) and the wafer (15) are arranged parallel to one another and bonded together with the aid of an adhesive layer (8) situated between the substrate (6) and the wafer (15), and wherein the |
| 8142701 |
Method and device for producing a nanopatterned disc |
March 27, 2012 |
| The invention relates to a method and a device according to the preambles of claims 1 and 10, and also to the use of a nanopatterned die, a disc with a defined nanopattern and a hard disk drive comprising a disc of this type. In order to propose a more rapidly operating device as well as |
| 8118290 |
Method for holding wafers and device for fixing two parallel arranged wafers relative to one ano |
February 21, 2012 |
| The invention relates to a device having a first holding instrument (1) for a first wafer (5) and having a second holding instrument (7) for a second wafer (9) arrangeable parallel to the first wafer (5), the two holding instruments (1, 7) being fixable relative to one another. Accor |
| 8087708 |
Handling device and handling method for wafers |
January 3, 2012 |
| The invention relates to a handling device and to a handling method for wafers, in particular for wafers with a thickness of less than 100 .mu.m. According to the invention it is provided that an adhesive membrane is arranged so as to delimit at least one workspace, the volume of which c |
| 7909374 |
Handling device and handling method for wafers |
March 22, 2011 |
| The invention relates to a handling device and to a handling method for wafers, in particular for wafers with a thickness of less than 100 .mu.m. According to the invention it is provided that an adhesive membrane is arranged so as to delimit at least one workspace, the volume of which c |
| 7598152 |
Device and method for bonding wafers |
October 6, 2009 |
| The invention relates to a device and a corresponding method for bonding wafers along their corresponding surfaces. |
| 7246445 |
Alignment device |
July 24, 2007 |
| The present invention relates to an alignment device for aligning an object in a plane. |
