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Browse by: INVENTOR PATENT HOLDER PATENT NUMBER DATE
 
 
Inventor:
Tang; Jinbang
Address:
Chandler, AZ
No. of patents:
19
Patents:












Patent Number Title Of Patent Date Issued
8293588 Method of providing an electronic device including dies, a dielectric layer, and an encapsulatin October 23, 2012
A method of packaging an electronic device includes providing a patterned dielectric layer with an area sized to receive a first die, and another area sized to receive a second die, placing the first and second dies within the first and second areas, encapsulating the dies with an en
8290736 Calibration standards and methods of their fabrication and use October 16, 2012
An embodiment of a calibration standard includes a substrate, a set of conductive structures fabricated on the substrate, and a conductive end structure fabricated on the substrate. The set of conductive structures include an inner conductive structure, a first outer conductive structure
8283764 Microelectronic assembly with an embedded waveguide adapter and method for forming the same October 9, 2012
A microelectronic assembly and a method for forming a microelectronic assembly are provided. A semiconductor substrate is provided. The semiconductor substrate has first and second opposing sides and first and second portions. A tuning depression is formed on the second opposing side
8168464 Microelectronic assembly with an embedded waveguide adapter and method for forming the same May 1, 2012
A microelectronic assembly and a method for forming a microelectronic assembly are provided. A semiconductor substrate (22) is provided. The semiconductor substrate (22) has first and second opposing sides (24, 26) and first and second portions (28, 30). A tuning depression (32) is f
8097494 Method of making an integrated circuit package with shielding via ring structure January 17, 2012
Electromagnetic shielding for an integrated circuit packaged device. The method includes forming shielding structures by forming openings in an encapsulated structure. The openings are filled with conductive material that surrounds at least one die. The encapsulated structure may include
8093700 Packaging millimeter wave modules January 10, 2012
A module, which in one embodiment may be a packaged millimeter waver module, includes a semiconductor lid portion; a packaging portion attached to the lid portion, wherein the packaging portion comprises a plurality of vias, a carrier portion, wherein a first semiconductor die is att
8004068 Shielded multi-layer package structures August 23, 2011
Embodiments include shielded multi-layer packages for use with multi-chip modules and the like. A substrate (102) (e.g., chip carrier) has an adhesive layer (104), where electronic components (106, 108) are attached. An insulating layer (110) is formed over the plurality of electroni
7981730 Integrated conformal shielding method and process using redistributed chip packaging July 19, 2011
An integrated conformal electromagnetic interference (EMI) and/or electromagnetic radiation shield is formed on a plurality of encapsulated modules by attaching a plurality of modules (30-33) to a process carrier (1) using a double side adhesive tape (2), and then sequentially deposi
7977785 Electronic device including dies, a dielectric layer, and a encapsulating layer July 12, 2011
An electronic device and a method of packaging an electronic device are disclosed. In one embodiment, the electronic device can include a first die. The electronic device can also include a dielectric layer defining a first opening. The first die can be disposed within the first opening.
7969164 Method and apparatus for mini module EMI shielding evaluation June 28, 2011
A method for mini module EMI shielding effectiveness evaluation comprises providing a test vehicle including at least one test platform. The test platform includes at least one mini emitter, a mini receiver with a reference shield, and a mini receiver with a shield under test. EMI sh
7869225 Shielding structures for signal paths in electronic devices January 11, 2011
A shielding structure is provided for shielding a signal path extending between a first layer and a second layer in an electronic device at a transition region with a transition that extends in a first direction and a second direction orthogonal to the first direction. The shielding
7842546 Integrated circuit module and method of packaging same November 30, 2010
An integrated circuit (IC) module (20) includes a ground plane (22) having adjoining cutouts (30, 32). The cutout (32) defines a critical signal pathway (38). A device (24) is positioned in the cutout (30) and a device (26) is positioned outside of the cutout (30) adjacent to the cutout
7838420 Method for forming a packaged semiconductor device November 23, 2010
A packaged semiconductor device includes an interconnect layer over a first side of a polymer layer, a semiconductor device surrounded on at least three sides by the polymer layer and coupled to the interconnect layer, a first conductive element over a second side of the polymer laye
7812448 Electronic device including a conductive stud over a bonding pad region October 12, 2010
An electronic device can include an interconnect level (16) including a bonding pad region (110). An insulating layer (18) can overlie the interconnect level (16) and include an opening (112, 24) over the bonding pad region (110). In one embodiment, a conductive stud (34) can lie wit
7772694 Integrated circuit module and method of packaging same August 10, 2010
An integrated circuit (IC) module (20) includes a ground plane (22) having adjoining cutouts (30, 32). The cutout (32) defines a critical signal pathway (38). A device (24) is positioned in the cutout (30) and a device (26) is positioned outside of the cutout (30) adjacent to the cutout
7763976 Integrated circuit module with integrated passive device July 27, 2010
A disclosed integrated circuit (IC) module includes an IC panel and multi level circuit structure, referred to as an IPD structure, overlying an upper surface of the IC panel. The IC panel includes an electrically conductive embedded ground plane (EGP), an integrated circuit (IC) die,
7651889 Electromagnetic shield formation for integrated circuit die package January 26, 2010
Electromagnetic shielding for an integrated circuit packaged device. The method includes forming shielding structures by forming openings in an encapsulated structure. The openings are filled with conductive material that surrounds at least one die. The encapsulated structure may include
7648858 Methods and apparatus for EMI shielding in multi-chip modules January 19, 2010
Methods and structures provide a shielded multi-layer package for use with multi-chip modules and the like. A substrate (102) (e.g., chip carrier) has an adhesive layer (104), where electronic components (106, 108) are attached. An insulating layer (110) is formed over the plurality of
7145084 Radiation shielded module and method of shielding microelectronic device December 5, 2006
A radiation shielded module (120, 500, 600, 700) and method of shielding microelectronic devices (126, 412, 618, and 718) including a single interconnect substrate (110, 400, 612, 712) having a first side (122, 410, 620, 720) and a second side (124, 416, 610, 710). At least one micro










 
 
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