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Inventor: Tanaka; Tadao
Address: Kosyoku, JP
No. of patents: 1
Patents:
| Patent Number |
Title Of Patent |
Date Issued |
| 6764392 |
Wafer polishing method and wafer polishing device |
July 20, 2004 |
| A polishing method and polishing apparatus capable of improving the flatness of a wafer are provided. When a wafer is adhered to a wafer holding plate for polishing a surface to be polished of the wafer by pressing and rubbing the surface to be polished against a polishing pad on a p |
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