Resources Contact Us Home
Tanaka; Tadao
Kosyoku, JP
No. of patents:

Patent Number Title Of Patent Date Issued
6764392 Wafer polishing method and wafer polishing device July 20, 2004
A polishing method and polishing apparatus capable of improving the flatness of a wafer are provided. When a wafer is adhered to a wafer holding plate for polishing a surface to be polished of the wafer by pressing and rubbing the surface to be polished against a polishing pad on a p

  Recently Added Patents
Active gate drive circuit
Utility knife
Transmission apparatus, receiving apparatus, method, and storage medium
Direct connect single layer touch panel
Method and device for the detection of defects or correction of defects in machines
Generator with a segmented stator
Optical packet signal transmission device and WDM optical communication network
  Randomly Featured Patents
Device and method for programmed hair coloring
Vitamin D derivative with substituent at the 2.beta.-position
History adding device for generating history-added image file, electronic camera, and image processing program for processing history-added image file
Vertical centrifuge having conveyor vibration damper
Security device simulating currency pack or the like
NCO based frequency synthesizer with jitter modulation
Process and additional devices of drying machines for the uniform drying of textiles
Method of fabricating stacked wire bonded semiconductor package with low profile bond line
Anonymous location service for wireless networks
Delivery tool and method for delivering bone growth material