Resources Contact Us Home
Browse by: INVENTOR PATENT HOLDER PATENT NUMBER DATE
 
 
Inventor:
Tanaka; Tadao
Address:
Kosyoku, JP
No. of patents:
1
Patents:












Patent Number Title Of Patent Date Issued
6764392 Wafer polishing method and wafer polishing device July 20, 2004
A polishing method and polishing apparatus capable of improving the flatness of a wafer are provided. When a wafer is adhered to a wafer holding plate for polishing a surface to be polished of the wafer by pressing and rubbing the surface to be polished against a polishing pad on a p










 
 
  Recently Added Patents
Semiconductor device and method of manufacturing the same
Wireless communications apparatus and wireless communications method
Vehicle control apparatus
Method and apparatus for predicting object properties and events using similarity-based information retrieval and modeling
Orbing and lighting systems
Method for manufacturing non-volatile memory device, non-volatile memory element, and non-volatile memory device
Light-emitting device with a spacer at bottom surface
  Randomly Featured Patents
Vehicle monitoring system
Chlamydia-free cell lines and animals
Method for heating primarily nozzles, and apparatus for carrying out the method
Method, apparatus and system for controlling a scene structure of multiple channels to be displayed on a mobile terminal in a mobile broadcast system
Method of optically measuring the surface of yarn packages
Linear slide with toothed belt drives
Monoclonal antibodies which discriminate between strains of citrus tristeza virus
Uterine cell sampler
Method and apparatus for measuring magnetic offset of geomagnetic sensor and portable electronic apparatus
Lubricants for use in processing of metallic material