Resources Contact Us Home
Browse by: INVENTOR PATENT HOLDER PATENT NUMBER DATE
 
 
Inventor:
Tanaka; Tadao
Address:
Kosyoku, JP
No. of patents:
1
Patents:












Patent Number Title Of Patent Date Issued
6764392 Wafer polishing method and wafer polishing device July 20, 2004
A polishing method and polishing apparatus capable of improving the flatness of a wafer are provided. When a wafer is adhered to a wafer holding plate for polishing a surface to be polished of the wafer by pressing and rubbing the surface to be polished against a polishing pad on a p










 
 
  Recently Added Patents
System and method for monitoring network activity
Fuser member
Compounds with (1 E, 6E)-1,7-bis-(3,4-dimethoxyphenyl)-4,4-disubstituted-hepta-1,6-diene-3,5-d- ione structural scaffold, their biological activity, and uses thereof
Identification wristband
Servomotor control circuit
Drive apparatus
Blueberry plant named `DrisBlueFour`
  Randomly Featured Patents
Distributed network application management system
Advanced cooperative defensive military tactics, armor, and systems
Wire rope lubrication device for a crane
Ceiling fan motor housing
Fluid control assembly with flange spacer
Combined electric shaver and cover therefor
Spoon
Weather radar simulator
Structured abrasives with adhered functional powders
Inorganic aqueous putty or liquid suspension, thermally insulating, non toxic, fire retardant