Resources Contact Us Home
Browse by: INVENTOR PATENT HOLDER PATENT NUMBER DATE
 
 
Inventor:
Tanaka; Tadao
Address:
Kosyoku, JP
No. of patents:
1
Patents:












Patent Number Title Of Patent Date Issued
6764392 Wafer polishing method and wafer polishing device July 20, 2004
A polishing method and polishing apparatus capable of improving the flatness of a wafer are provided. When a wafer is adhered to a wafer holding plate for polishing a surface to be polished of the wafer by pressing and rubbing the surface to be polished against a polishing pad on a p










 
 
  Recently Added Patents
Methods and systems for distributing broadcast messages on various networks
Method for producing carrier on which microorganisms capable of conducting multiple parallel mineralization are immobilized, column reactor and solid medium for cultivating plants
Music composition automation including song structure
Neurophysiological central auditory processing evaluation system and method
Electronic device assemblies
Method and apparatus for modeling computer program behaviour for behavioural detection of malicious program
Substituted thiophene pentamers
  Randomly Featured Patents
Pyrrolidone-carboxylic modified polysiloxanes having aqueous and detergent solubilities and water-in-oil emulsion capability
Cushion pad with enhanced conformability
Hand-held toilet paper gripping device
Apparatus and method for correcting and adjusting parallax in electronic camera
Inhibition of 5-lipoxygenase products
Pressure controlled cryopump regeneration method and system
Optical aperture for data recording having transmission enhanced by surface plasmon resonance
Automating power domains in electronic design automation
Production of aluminum chloride
Preamplifier with improved CMRR and temperature stability and associated amplification method