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Inventor:
Tanaka; Tadao
Address:
Kosyoku, JP
No. of patents:
1
Patents:












Patent Number Title Of Patent Date Issued
6764392 Wafer polishing method and wafer polishing device July 20, 2004
A polishing method and polishing apparatus capable of improving the flatness of a wafer are provided. When a wafer is adhered to a wafer holding plate for polishing a surface to be polished of the wafer by pressing and rubbing the surface to be polished against a polishing pad on a p










 
 
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