Resources Contact Us Home
Browse by: INVENTOR PATENT HOLDER PATENT NUMBER DATE
 
 
Inventor:
Tanaka; Tadao
Address:
Kosyoku, JP
No. of patents:
1
Patents:












Patent Number Title Of Patent Date Issued
6764392 Wafer polishing method and wafer polishing device July 20, 2004
A polishing method and polishing apparatus capable of improving the flatness of a wafer are provided. When a wafer is adhered to a wafer holding plate for polishing a surface to be polished of the wafer by pressing and rubbing the surface to be polished against a polishing pad on a p










 
 
  Recently Added Patents
Light source lighting device including a constant-current supply that is connected to a light source and supplies a constant current of a substantially constant magnitude to the light source,
High-efficiency preambles for communications systems over pseudo-stationary communication channels
UV liquid treatment system
Double patterning method using tilt-angle deposition
Surveillance apparatus and method for wireless mesh network
Method to alter silicide properties using GCIB treatment
Video editing apparatus
  Randomly Featured Patents
Method and apparatus for sorting coins
Optical data communication and location apparatus, system and method and transmitters and receivers for use therewith
Portable device for generating a current in a vessel
Process for the production of foamed materials from polyolefins
Wall supporting structure
Low voltage analog-to-digital converters with internal reference voltage and offset
Acidproof lining material
Fishing rod illumination system
Stable, catalyzed, high temperature combustion in microchannel, integrated combustion reactors
Vehicle front body structure of a vehicle of framed construction