Resources Contact Us Home
Browse by: INVENTOR PATENT HOLDER PATENT NUMBER DATE
 
 
Inventor:
Tanaka; Kazutaka
Address:
Ogaki, JP
No. of patents:
1
Patents:












Patent Number Title Of Patent Date Issued
8143534 Wiring board having solder bump and method for manufacturing the same March 27, 2012
A wiring board has a wiring board main body, a solder resist and solder bumps. The solder resist is formed on a top surface of the wiring board main body, and includes first openings, and second openings that have a diameter larger than that of the first openings. The solder bumps are










 
 
  Recently Added Patents
Data unit receiver and sender control method
Image forming apparatus capable of timely starting different image formation mode
Apparatus and method for adapted deblocking filtering strength
Electric rotating machine for vehicle
Carbonate and carbamate modified forms of glucocorticoids in combination with .beta..sub.2 adrenergic agonists
Data consumption framework for semantic objects
Methods and systems providing desktop search capability to software application
  Randomly Featured Patents
Medical connector docking device
Door face panel
Fan bracket
Multiwinning opportunities in pick and select gaming platform
Method and apparatus for creating and using search information
Milking parlor systems and methods
Positioning system with co-polarized and cross-polarized mapping
Electro-magnetic acoustic measurements combined with acoustic wave analysis
Polypeptide that interacts with heat shock proteins
Use of R-enantiomer of N-propargyl-1-aminoindan, salts, and compositions thereof