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Tanaka; Kazutaka
Ogaki, JP
No. of patents:

Patent Number Title Of Patent Date Issued
8143534 Wiring board having solder bump and method for manufacturing the same March 27, 2012
A wiring board has a wiring board main body, a solder resist and solder bumps. The solder resist is formed on a top surface of the wiring board main body, and includes first openings, and second openings that have a diameter larger than that of the first openings. The solder bumps are

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