Resources Contact Us Home
Browse by: INVENTOR PATENT HOLDER PATENT NUMBER DATE
 
 
Inventor:
Tanaka; Kazutaka
Address:
Ogaki, JP
No. of patents:
1
Patents:












Patent Number Title Of Patent Date Issued
8143534 Wiring board having solder bump and method for manufacturing the same March 27, 2012
A wiring board has a wiring board main body, a solder resist and solder bumps. The solder resist is formed on a top surface of the wiring board main body, and includes first openings, and second openings that have a diameter larger than that of the first openings. The solder bumps are










 
 
  Recently Added Patents
Method and system for detecting data modification within computing device
Wheel
Storage device, data processing device, registration method, and recording medium
Direct connect single layer touch panel
Process to increase selectivity to ethylene in oxygenates-to-olefins conversions
Methods and apparatus for determining a phase error in signals
Adaptive contact window wherein the probability that an answering user/expert will respond to a question corresponds to the answering users having response rates that are based on the time of
  Randomly Featured Patents
Implanted barrier layer to improve line reliability and method of forming same
Organizer console
Energy absorbing bolster assembly
Funnel apparatus for filling hollowed sandwich rolls
Production process for carboxylic amide and derivatives thereof
Simultaneous compiler binary optimizations
Apparatus for thickening pulp and paper stock
Electronic stick package
Uranium oxide production
Method of forming CMOS imager with storage capacitor