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Inventor: Tanaka; Kazutaka
Address: Ogaki, JP
No. of patents: 1
Patents:
| Patent Number |
Title Of Patent |
Date Issued |
| 8143534 |
Wiring board having solder bump and method for manufacturing the same |
March 27, 2012 |
| A wiring board has a wiring board main body, a solder resist and solder bumps. The solder resist is formed on a top surface of the wiring board main body, and includes first openings, and second openings that have a diameter larger than that of the first openings. The solder bumps are |
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