Resources Contact Us Home
Browse by: INVENTOR PATENT HOLDER PATENT NUMBER DATE
 
 
Inventor:
Tanaka; Kazutaka
Address:
Ogaki, JP
No. of patents:
1
Patents:












Patent Number Title Of Patent Date Issued
8143534 Wiring board having solder bump and method for manufacturing the same March 27, 2012
A wiring board has a wiring board main body, a solder resist and solder bumps. The solder resist is formed on a top surface of the wiring board main body, and includes first openings, and second openings that have a diameter larger than that of the first openings. The solder bumps are










 
 
  Recently Added Patents
Method and apparatus for detection of the remote origin fraction of radon present in a measuring site
System and method for dynamic quality-of-service-based billing in a peer-to-peer network
Pet carrier
Press nut
Electronic device with a screen
Switching element for a valve train of an internal combustion engine
Semiconductor device having a bonding pad and shield structure of different thickness
  Randomly Featured Patents
Window laser with high power reduced divergence output
Set of surface patterns for a tapestry for a chair
Electroluminescence display device
Method of using multiple stressed sealing plugs to filter polymeric material
Cooling arrangement for a glass forming apparatus
Carburetors or fuel mixing systems
Asynchronous TMR processing system
Method, system, and program for providing data updates to a page including multiple regions of dynamic content
Hybrid mobile robot
Reading lens system