Resources Contact Us Home
Tanaka; Kazutaka
Ogaki, JP
No. of patents:

Patent Number Title Of Patent Date Issued
8143534 Wiring board having solder bump and method for manufacturing the same March 27, 2012
A wiring board has a wiring board main body, a solder resist and solder bumps. The solder resist is formed on a top surface of the wiring board main body, and includes first openings, and second openings that have a diameter larger than that of the first openings. The solder bumps are

  Recently Added Patents
Method and apparatus for detecting an intermittent path to a storage system
Evolutionary clustering algorithm
Switchable memory diodes based on ferroelectric/conjugated polymer heterostructures and/or their composites
System for seeking for an optimal configuration of a bi-, tri- or multi-ventricular cardiac resynchronization implanted device
Customizing a range of acceptable tape dimensional stability write conditions
Antibodies to CCR2
  Randomly Featured Patents
Transmission having a coaxial lubricant pump
Anti-aging additive composition for a quench oil circuit in an ethylene production plant and method of operating the circuit
Metal particle removal and retention apparatus
Cache memory for identifying locked and least recently used storage locations
Network analyzer calibration employing reciprocity of a device
Sun-tracing sunshade apparatus
Ink stick for phase change ink jet printer
Illuminated display panel
Catalyst and process for the selective hydrogenation of multi-unsaturated organic compounds
Potentiometric electrode, gradient polymer, uses and method of preparation therefor