Resources Contact Us Home
Browse by: INVENTOR PATENT HOLDER PATENT NUMBER DATE
 
 
Inventor:
Tanaka; Kazutaka
Address:
Ogaki, JP
No. of patents:
1
Patents:












Patent Number Title Of Patent Date Issued
8143534 Wiring board having solder bump and method for manufacturing the same March 27, 2012
A wiring board has a wiring board main body, a solder resist and solder bumps. The solder resist is formed on a top surface of the wiring board main body, and includes first openings, and second openings that have a diameter larger than that of the first openings. The solder bumps are










 
 
  Recently Added Patents
Continuously variable transmission and control method thereof
Estimating stack distances
Combined high and low frequency stimulation therapy
Lighting device with device for regulating the illumination according to the luminance of the illumination field and corresponding use
Wireless control kit for camera
Carbonate and carbamate modified forms of glucocorticoids in combination with .beta..sub.2 adrenergic agonists
Defensin polynucleotides and methods of use
  Randomly Featured Patents
Insertion of the Bacillus thuringiensis crystal protein gene into plant colonizing microorganisms and their use
Disposable liner for a cooler
System, adaptor and method to provide medical electrical stimulation
Sealing cap for vacuum containers
Video control system
Water soluble photoresist composition with bisazide, diazo, polymer and silane
Raised vertical channel transistor device
Methods and devices responsive to ambient audio
Reducing the memory required for decompression by storing compressed information using DCT based techniques
Optical position detection device