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Browse by: INVENTOR PATENT HOLDER PATENT NUMBER DATE
 
 
Inventor:
Takesue; Masakazu
Address:
Kawasaki, JP
No. of patents:
17
Patents:












Patent Number Title Of Patent Date Issued
7963434 Micro component removing method June 21, 2011
A method and an apparatus for removing a micro component surely and leveling solder remaining on a substrate without imposing thermal damage to solder lands, the substrate and components on the periphery. A thermosetting adhesive (15) is provided on the surface (12a) of a micro compo
7753251 Micro component removing apparatus July 13, 2010
A method and a apparatus for removing a micro component surely and leveling solder remaining on a substrate without imposing thermal damage to solder lands, the substrate and components on the periphery. A thermosetting adhesive (15) is provided on the surface (12a) of a micro compon
7491893 Mounting substrate and mounting method of electronic part February 17, 2009
A mounting substrate includes a land connected to an electrode of an electronic part by a melt-capable connection member; and a connection member flow-generation part configured to generate a flow at the molten melt-capable connection member.
6984254 Lead-free solder alloy and a manufacturing process of electric and electronic apparatuses using January 10, 2006
A lead-free solder powder that can include a plurality of lead-free solder particles each having a general spherical shape with a diameter of 20 60 .mu.m. Each of the lead-free solder particles can contain Sn, Ag and Bi, with respective concentrations set such that the lead-free solder a
6893512 Solder alloy and soldered bond May 17, 2005
A solder alloy having a solderability comparable to that of a conventional Pb--Sn solder alloy without having a detrimental effect on the environment and a soldered bond using the same. A solder alloy consisting of Zn: 4.0-10.0 wt %, In: 1.0 to 15.0 wt %, Al: 0.0020 to 0.0100 wt %, and t
6786385 Semiconductor device with gold bumps, and method and apparatus of producing the same September 7, 2004
A semiconductor device includes a semiconductor element having electrodes and metal bumps are attached to the electrodes. The metal bumps include copper cores and gold surface layers covering the cores. In addition, the metal bumps may include gold bump elements and solder bump elements
6744183 Method of bonding piezoelectric element and electrode, and piezoelectric microactuator using the June 1, 2004
A method of bonding a piezoelectric element and an electrode, including the steps of forming a first coating of a material selected from the group consisting of Au, Al, Zn, Cu, and Sn on a bonding surface of the piezoelectric element, and forming a second coating of a material selected
6596094 Solder paste and electronic device July 22, 2003
A solder paste, includes a flux, a solder alloy particle scattered or mixed in the flux and including Sn and Zn as composition elements, and a metal particle scattered or mixed in the flux and including an element in the IB group in the periodic table as a composition element.
6541898 Method of bonding piezoelectric element and electrode, and piezoelectric microactuator using the April 1, 2003
A method of bonding a piezoelectric element and an electrode, including the steps of forming a first coating of a material selected from the group consisting of Au, Al, Zn, Cu, and Sn on a bonding surface of the piezoelectric element, and forming a second coating of a material selected
6521176 Lead-free solder alloy and a manufacturing process of electric and electronic apparatuses using February 18, 2003
A lead-free solder alloy composition containing Sn, Ag and Bi, with respective concentrations set such that the lead-free solder alloy has a melting temperature lower than a predetermined heat-resistant temperature of a work to be soldered.
6495441 Semiconductor device with gold bumps, and method and apparatus of producing the same December 17, 2002
A semiconductor device comprises a semiconductor element having electrodes and metal bumps are attached to the electrodes. The metal bumps include copper cores and gold surface layers covering the cores. In addition, the metal bumps may include gold bump elements and solder bump elements
6467141 Method of assembling micro-actuator October 22, 2002
A method of assembling a micro-actuator is provided in which a base frame having a plurality of actuator bases is placed on a stage, a first adhesive is applied to each of the actuator bases, and a base electrode frame having a plurality of base electrodes is placed on the first adhe
6428911 Soldering method and soldered joint August 6, 2002
The present invention provides a soldering method and a soldered joint securing a strength of joint equivalent to soldering using a conventional Pb--Sn solder alloy without having a detrimental effect on the environment and without causing a rise in cost. A soldering method comprising a
6361626 Solder alloy and soldered bond March 26, 2002
A Pb-free solder alloy and a soldered bond using the same, in which the solder alloy has no harmful environmental effect but has a solderability comparable to that of the conventional Pb--Sn solder alloy. The solder alloy of the present invention either consists of Zn: 3.0-14.0 wt %, Al:
6344690 Semiconductor device with gold bumps, and method and apparatus of producing the same February 5, 2002
A semiconductor device comprises a semiconductor element having electrodes and metal bumps are attached to the electrodes. The metal bumps include copper cores and gold surface layers covering the cores. In addition, the metal bumps may include gold bump elements and solder bump elements
6333554 Semiconductor device with gold bumps, and method and apparatus of producing the same December 25, 2001
A semiconductor device comprises a semiconductor element having electrodes and metal bumps are attached to the electrodes. The metal bumps include copper cores and gold surface layers covering the cores. In addition, the metal bumps may include gold bump elements and solder bump elements
6184475 Lead-free solder composition with Bi, In and Sn February 6, 2001
A lead-free solder alloy composition contains Sn, Bi and In, with respective contents such that the solder alloy composition provides a liquidus temperature below the heat resistant temperature of a work to be soldered. The alloy contains not more than about 60 wt % Bi; not more than










 
 
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