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Browse by: INVENTOR PATENT HOLDER PATENT NUMBER DATE
 
 
Inventor:
Takemura; Katsuya
Address:
Joetsu, JP
No. of patents:
14
Patents:












Patent Number Title Of Patent Date Issued
8247166 Double patterning process August 21, 2012
A double pattern is formed by coating a first positive resist composition onto a substrate, patternwise exposure to radiation, and development with alkaline developer to form a first resist pattern; applying heat and/or radiation to render the first resist pattern insoluble in a second
8153836 Silsesquioxane compound mixture, hydrolyzable silane compound, making methods, resist compositio April 10, 2012
In a mixture of silsesquioxane compounds comprising silsesquioxane units having a side chain including a direct bond between a silicon atom and a norbornane skeleton and having a degree of condensation of substantially 100%, a dimethylene chain of the norbornane skeleton remote from the
8129100 Double patterning process March 6, 2012
Double patterns are formed by coating a chemically amplified positive resist composition comprising an acid labile group-bearing resin and a photoacid generator and prebaking to form a resist film on a processable substrate, exposing the resist film to high-energy radiation, PEB, and
8129099 Double patterning process March 6, 2012
Double patterns are formed by coating a first chemically amplified positive resist composition comprising an acid labile group-bearing resin and a photoacid generator and prebaking to form a resist film on a processable substrate, exposing the resist film to high-energy radiation, PE
7745094 Resist composition and patterning process using the same June 29, 2010
A resist composition is provided comprising a silicone resin, a photoacid generator, a nitrogen-containing organic compound, and a solvent. The silicone resin is obtained through cohydrolytic condensation of a mixture of three silane monomers containing a fluorinated norbornane group, an
7741015 Patterning process and resist composition June 22, 2010
A pattern is formed by applying a positive resist composition comprising a polymer comprising 7-oxanorbornane ring-bearing recurring units and acid labile group-bearing recurring units and an acid generator onto a substrate to form a resist film, heat treating and exposing the resist
7638260 Positive resist compositions and patterning process December 29, 2009
A positive resist composition comprises (A) a resin component which becomes soluble in an alkaline developer under the action of an acid and (B) an acid generator. The resin (A) is a polymer comprising specific recurring units. When processed by ArF lithography, the composition is im
7618764 Positive resist compositions and patterning process November 17, 2009
A positive resist composition comprises (A) a resin component which becomes soluble in an alkaline developer under the action of an acid and (B) an acid generator. The resin (A) is a polymer comprising specific recurring units. The acid generator (B) is a specific sulfonium salt comp
7550247 Resist composition and patterning process June 23, 2009
A resist composition is provided comprising a silicone resin, a photoacid generator, a nitrogen-containing organic compound, and a solvent. The silicone resin is obtained through cohydrolytic condensation of a mixture of three silane monomers containing an organic group having a hydroxyl
7510816 Silicon-containing resist composition and patterning process March 31, 2009
A resist composition is provided comprising a polysiloxane, a specific acid generator, a nitrogen-containing organic compound, and a solvent. The resist composition exerts high-resolution performance without the problem of a T-top profile and is suited for the bilayer resist process
7494760 Photoacid generators, chemically amplified resist compositions, and patterning process February 24, 2009
A photoacid generator has formula (1) wherein R is H, F, Cl, nitro, alkyl or alkoxy, n is 0 or 1, m is 1 or 2, r is an integer of 0-4, and r' is an integer of 0-5. A chemically amplified resist composition comprising the photoacid generator has advantages including a high resolution, foc
7261995 Nitrogen-containing organic compound, chemically amplified resist composition and patterning pro August 28, 2007
Chemically amplified resist compositions comprising nitrogen-containing organic compounds having a 7-oxanorbornane-2-carboxylic ester structure have resolution and provide a precise pattern profile and are useful in microfabrication using electron beams or deep-UV light.
5759739 Resist composition with polymeric dissolution inhibitor and alkali soluble resin June 2, 1998
A resist composition comprising an alkali-soluble resin, typically a partially t-butoxycarbonylated polyhydroxystyrene, a p-butoxystyrene/t-butylacrylate copolymer or p-butoxystyrene/maleic anhydride copolymer as a dissolution inhibitor, and a iodonium or sulfonium salt as a photoaci
5455360 1-pyrrolyl silicon compounds, chemically adsorbed ultrathin film formed therefrom and method of October 3, 1995
Disclosed are a conductive pyrrole derivative monomolecular film covalently bonded to a substrate surface and method of manufacturing the same, and a monomer used for forming the conductive pyrrole derivative monomolecular film and method of manufacturing the same. The invention relates










 
 
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