| Patent Number |
Title Of Patent |
Date Issued |
| 8300875 |
Speaker diaphragm and speaker including the same |
October 30, 2012 |
| A speaker diaphragm includes a thermoplastic resin having a three-layer structure. The three-layer structure includes a polyester film as a base material of the three-layer structure, a polyimide-based resin layer as a top layer of the three-layer structure, and another polyimide-based r |
| 8217276 |
Multilayer printed circuit board and method of manufacturing multilayer printed circuit board |
July 10, 2012 |
| A multilayer printed circuit board which can surely establish interlayer connection with low resistance. The multilayer printed circuit board comprises: a first substrate having a conductive pattern on one face and a non-penetration connection hole on the other face, for exposing the |
| 7980355 |
Acoustic diaphragm, and method of fabricating acoustic diaphragm |
July 19, 2011 |
| There is provided an acoustic diaphragm used for a loudspeaker, having an injection-molded edge molded using a thermoplastic elastomer, in which the edge is formed using a workable polyolefinic elastomer, as a material, containing a soft segment having rubber particles of 1 .mu.m to |
| 7546897 |
Speaker diaphragm and method of manufacturing speaker diaphragm |
June 16, 2009 |
| A speaker diaphragm made of a resin containing a thermoplastic polymeric material is provided. The speaker diaphragm includes a changed portion formed on the diaphragm that is molded using the resin. The changed portion is formed by partially changing physical properties of the therm |
| 7527124 |
Loudspeaker diaphragm |
May 5, 2009 |
| Wholly aromatic polyamide fibers cut to a length of 0.5 to 5 mm are dispersedly contained in an injection-moldable thermoplastic resin, and the resin is molded by ultrahigh-speed thin-wall injection molding so as to produce a loudspeaker diaphragm in which the wholly aromatic polyamide |
| 6710261 |
Conductive bond, multilayer printed circuit board, and method for making the multilayer printed |
March 23, 2004 |
| A conductive bond comprises conductive colloidal particles and a dispersant for dispersing the conductive colloidal particles. A multilayer printed circuit board includes a plurality of substrates, each having a conductive pattern on at least one face thereof. Any adjacent two of the sub |
| 6469255 |
Composite wiring board and manufacturing method thereof |
October 22, 2002 |
| There is provided a composite wiring board that occupies a small space and is low in price and a manufacturing method thereof; the composite wiring board comprises at least two rigid wiring boards on end faces of which connection portions are formed, in which each of the rigid wiring boa |
