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Browse by: INVENTOR PATENT HOLDER PATENT NUMBER DATE
 
 
Inventor:
Takebe; Toru
Address:
Tokyo, JP
No. of patents:
7
Patents:












Patent Number Title Of Patent Date Issued
8300875 Speaker diaphragm and speaker including the same October 30, 2012
A speaker diaphragm includes a thermoplastic resin having a three-layer structure. The three-layer structure includes a polyester film as a base material of the three-layer structure, a polyimide-based resin layer as a top layer of the three-layer structure, and another polyimide-based r
8217276 Multilayer printed circuit board and method of manufacturing multilayer printed circuit board July 10, 2012
A multilayer printed circuit board which can surely establish interlayer connection with low resistance. The multilayer printed circuit board comprises: a first substrate having a conductive pattern on one face and a non-penetration connection hole on the other face, for exposing the
7980355 Acoustic diaphragm, and method of fabricating acoustic diaphragm July 19, 2011
There is provided an acoustic diaphragm used for a loudspeaker, having an injection-molded edge molded using a thermoplastic elastomer, in which the edge is formed using a workable polyolefinic elastomer, as a material, containing a soft segment having rubber particles of 1 .mu.m to
7546897 Speaker diaphragm and method of manufacturing speaker diaphragm June 16, 2009
A speaker diaphragm made of a resin containing a thermoplastic polymeric material is provided. The speaker diaphragm includes a changed portion formed on the diaphragm that is molded using the resin. The changed portion is formed by partially changing physical properties of the therm
7527124 Loudspeaker diaphragm May 5, 2009
Wholly aromatic polyamide fibers cut to a length of 0.5 to 5 mm are dispersedly contained in an injection-moldable thermoplastic resin, and the resin is molded by ultrahigh-speed thin-wall injection molding so as to produce a loudspeaker diaphragm in which the wholly aromatic polyamide
6710261 Conductive bond, multilayer printed circuit board, and method for making the multilayer printed March 23, 2004
A conductive bond comprises conductive colloidal particles and a dispersant for dispersing the conductive colloidal particles. A multilayer printed circuit board includes a plurality of substrates, each having a conductive pattern on at least one face thereof. Any adjacent two of the sub
6469255 Composite wiring board and manufacturing method thereof October 22, 2002
There is provided a composite wiring board that occupies a small space and is low in price and a manufacturing method thereof; the composite wiring board comprises at least two rigid wiring boards on end faces of which connection portions are formed, in which each of the rigid wiring boa










 
 
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