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Inventor: Takayanagi; Fumikazu
Address: Tokyo, JP
No. of patents: 3
Patents:
| Patent Number |
Title Of Patent |
Date Issued |
| 7554136 |
Micro-switch device and method for manufacturing the same |
June 30, 2009 |
| A micro device that is manufactured by semiconductor process and is electrically connected to outside for its operation. The micro device includes a circuit board, an electrode pad being provided on the circuit board, a lead substrate being provided substantially parallel to the circ |
| 7477003 |
Bimorph element, bimorph switch, mirror element, and method for manufacturing these |
January 13, 2009 |
| There is provided a bimorph element including a silicon oxide layer, a high expansion coefficient layer that is formed on the silicon oxide layer and has a thermal expansion coefficient higher than a thermal expansion coefficient of the silicon oxide layer, and a deformation preventi |
| 6937040 |
Probe module and a testing apparatus |
August 30, 2005 |
| A probe module electrically coupled to a terminal of a device under test for sending and/or receiving a signal to and/or from the device under test, includes a first substrate, a probe pin provided on the first substrate to be in contact with the terminal of the device under test, a |
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