Resources Contact Us Home
Browse by: INVENTOR PATENT HOLDER PATENT NUMBER DATE
 
 
Inventor:
Takahashi; Noriyuki
Address:
Yonezawa, JP
No. of patents:
11
Patents:












Patent Number Title Of Patent Date Issued
7816185 Method of manufacturing a semiconductor device October 19, 2010
A semiconductor device manufacturing method comprising the steps of providing a matrix substrate having a main surface with plural device areas formed thereon, fixing plural semiconductor chips to the plural device areas respectively, then sealing the plural semiconductor chips all t
7615872 Semiconductor device November 10, 2009
A semiconductor device comprises: a package substrate having a plurality of bonding electrodes arranged in a peripheral region of a main surface thereof and wirings connected to the respective bonding electrodes and electrolessly plated; a semiconductor chip mounted on the package su
7579216 Method of manufacturing a semiconductor device August 25, 2009
A semiconductor device manufacturing method comprising the steps of providing a matrix substrate having a main surface with plural device areas formed thereon, fixing plural semiconductor chips to the plural device areas respectively, then sealing the plural semiconductor chips all t
7479705 Semiconductor device January 20, 2009
A semiconductor device comprises: a package substrate having a plurality of bonding electrodes arranged in a peripheral region of a main surface thereof and wirings connected to the respective bonding electrodes and electrolessly plated; a semiconductor chip mounted on the package su
7384820 Method of manufacturing a semiconductor device June 10, 2008
A semiconductor device manufacturing method comprising the steps of providing a matrix substrate having a main surface with plural device areas formed thereon, fixing plural semiconductor chips to the plural device areas respectively, then sealing the plural semiconductor chips all t
7033857 Method of manufacturing a semiconductor device April 25, 2006
A semiconductor device manufacturing method comprising the steps of providing a matrix substrate having a main surface with plural device areas formed thereon, fixing plural semiconductor chips to the plural device areas respectively, then sealing the plural semiconductor chips all t
7015069 Method of manufacturing a semiconductor device and a semiconductor device March 21, 2006
The back side of a strip substrate with plural semiconductor chips mounted thereon is vacuum-chucked to a lower mold half of a mold, and in this state the plural semiconductor chips are sealed with resin simultaneously to form a seal member. Thereafter, the strip substrate and the seal
6872597 Method of manufacturing a semiconductor device and a semiconductor device March 29, 2005
The back side of a strip substrate with plural semiconductor chips mounted thereon is vacuum-chucked to a lower mold half of a mold, and in this state the plural semiconductor chips are sealed with resin simultaneously to form a seal member. Thereafter, the strip substrate and the seal m
6723583 Method of manufacturing a semiconductor device using a mold April 20, 2004
The back side of a strip substrate with plural semiconductor chips mounted thereon is vacuum-chucked to a lower mold half of a mold, and in this state the plural semiconductor chips are sealed with resin simultaneously to form a seal member. Thereafter, the strip substrate and the seal m
6645794 Method of manufacturing a semiconductor device by monolithically forming a sealing resin for sea November 11, 2003
In a semiconductor device manufacturing method in which a package including a semiconductor chip is mounted on a wiring board via tape ball grid array (TBGA), a tape base material having a device hole and a plurality of leads is provided with one end of the leads extended inside the devi
6596561 Method of manufacturing a semiconductor device using reinforcing patterns for ensuring mechanica July 22, 2003
The back side of a strip substrate with plural semiconductor chips mounted thereon is vacuum-chucked to a lower mold half of a mold, and in this state the plural semiconductor chips are sealed with resin simultaneously to form a seal member. Thereafter, the strip substrate and the seal m










 
 
  Recently Added Patents
Variety corn line NPAA2675
Color image forming apparatus with contact control of process units
Portable stand
Collaborative data redundancy for configuration tracking systems
Ni-, Co-, and Mn- multi-element doped positive electrode material for lithium battery and its preparation method
Method and apparatus for a battery docking connector having reserve power for hot battery swap
Navigating applications using side-mounted touchpad
  Randomly Featured Patents
Test optical disk and manufacturing method thereof
Liquid crystal display panel capable of reducing persistence degree and development method thereof
GP40 and uses thereof
Unsaturated polyester composition
Regulation of service in restricted telecommunication service area
Processing system with interspersed processors using shared memory of communication elements
Process for producing thermoplastic resin highly resistant to impact and weather
Pancake and egg cooking appliance
Hand held transfer tape dispenser
Radio LAN system and radio LAN system signal collision evading method