| Patent Number |
Title Of Patent |
Date Issued |
| D303723 |
Facial treatment unit or the like |
September 26, 1989 |
|
| 7315964 |
Digital signal measuring apparatus and traffic observing method |
January 1, 2008 |
| A digital signal measuring apparatus comprises a bus probe unit for extracting a bus event occurring on a bus based on a digital bus signal on the bus of the system to be measured, a traffic measuring unit for counting the number of occurrences of bus event based on the occurrence in |
| 6422452 |
Method and apparatus for lining up micro-balls |
July 23, 2002 |
| An apparatus for lining up micro-balls in accordance with the present invention includes: ball carrying pallets having a plurality of pits for holding the micro-balls, respectively, on its surface, a pallet holder for holding the ball carrying pallets, a lining-up container defining a se |
| 6378756 |
Solder ball arrangement device |
April 30, 2002 |
| A solder ball arrangement device has a thin arrangement plate having a plurality of through-holes of a truncated pyramid shape, a porous member bonded to the arrangement plate, and a housing member for receiving the arrangement plate and the porous member for defining an air space inside |
| 6287892 |
Shock-resistant semiconductor device and method for producing same |
September 11, 2001 |
| A plurality of substrate to which have been flip-chip mounted semiconductor chips are laminated by solder bumps provided for the purpose of lamination. A elastic resin is caused to fill the space between the chip upper surface and the substrate, thus providing a shock-absorbing material |
| 6191482 |
Semiconductor chip carrier having partially buried conductive pattern and semiconductor device u |
February 20, 2001 |
| A semiconductor chip is mounted on a semiconductor chip carrier through a flip chip bonding technique; the semiconductor chip carrier includes an insulating layer such as synthetic resin having a mounting area assigned to the semiconductor chip and a conductive pattern having pads bonded |
| 6096259 |
Fabrication method of plastic-molded lead component |
August 1, 2000 |
| A fabrication method of a plastic-molded lead component is provided, in which leads are aligned at a fine pitch of approximately 100 .mu.m or less with a high accuracy, a simplified process sequence, and a low cost. First, a template having opened V-grooves is prepared. The V-grooves |
| 6095398 |
Solder ball arrangement device |
August 1, 2000 |
| A solder ball arrangement device has a thin arrangement plate having a plurality of through-holes of a truncated pyramid shape, a porous member bonded to the arrangement plate, and a housing member for receiving the arrangement plate and the porous member for defining an air space inside |
| 6025648 |
Shock resistant semiconductor device and method for producing same |
February 15, 2000 |
| A plurality of substrates 1 to which have been flip-chip mounted semiconductor chips 2 are laminated by means of solder bumps 7 provided for the purpose of lamination. A elastic resin is caused to fill the space between the chip upper surface 9 and the substrate 1, thus providing a s |
| 5976965 |
Method for arranging minute metallic balls |
November 2, 1999 |
| A method for arranging metallic balls to form an array of bump electrodes comprises the steps of immersing a silicon template in ethanol dropping metallic balls through the ethanol onto the template to receive the metallic balls in the holes of the template. The metallic balls are free |
| 5793117 |
Semiconductor device and method of fabricating the same |
August 11, 1998 |
| The invention provides a semiconductor device including a semiconductor substrate formed thereon with at least one recessed portion, an electrically conductive layer covering at least a surface of the recessed portion therewith, and a ball-bump formed on the electrically conductive l |
| 5600180 |
Sealing structure for bumps on a semiconductor integrated circuit chip |
February 4, 1997 |
| A sealing structure for bumps on a semiconductor integrated circuit chip to be bonded through the bumps onto a circuit board is provided wherein a plurality of pads are formed on the semiconductor integrated circuit chip. Each of the pads is formed with a bump thereon. A coating material |
| 5528456 |
Package with improved heat transfer structure for semiconductor device |
June 18, 1996 |
| The invention provides a package with an improved semiconductor device heat transfer structure including a semiconductor integrated circuit chip mounted on a substrate, a package for receiving the semiconductor integrated circuit chips mounted on the substrate, a radiator being attac |
| 5197082 |
Digital signal regenerator |
March 23, 1993 |
| Disclosed is a digital signal regenerator responsive to a data bit stream having a predetermined bit rate for generating a retimed data bit stream. The digital signal regenerator includes a transition detect and pulse generating circuit responsive to the data bit stream for detecting |
