To prevent semiconductor chips from adhering to the trays during transport, a method is employed which transports semiconductor chips in the following state. When trays provided with a plurality of accommodating portions having a recessed cross section for accommodating semiconductor
A method of manufacturing a thin, small-sized, inexpensive, non-leaded, resin-sealed type semiconductor device is disclosed. A flexible tape having plural terminals peelably through a first adhesive in a product forming portion formed on a main surface of the tape is provided, a semi
