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Browse by: INVENTOR PATENT HOLDER PATENT NUMBER DATE
 
 
Inventor:
Sukegawa; Shunichi
Address:
Ibaraki, JP
No. of patents:
12
Patents:




Patent Number Title Of Patent Date Issued
7626552 Semiconductor device, substrate, equipment board, method for producing semiconductor device, and December 1, 2009
A semiconductor device includes a first substrate having a first surface for mounting an electronic component and a second surface substantially parallel to the first surface. The first substrate includes a first region for mounting the electronic component, a second region including a
7579691 Semiconductor device, substrate, equipment board, method for producing semiconductor device, and August 25, 2009
A semiconductor device includes a first substrate having a first surface for mounting an electronic component and a second surface substantially parallel to the first surface. The first substrate includes a first region for mounting the electronic component, a second region including a
7578676 Semiconductor device August 25, 2009
A semiconductor device includes a first plate member having a circuit surface on which a circuit is provided, a second plate member having a circuit surface on which a circuit is provided, a plurality of first flat plates disposed on the circuit surface of the first plate member, a first
7554186 Semiconductor device June 30, 2009
A semiconductor device includes a first semiconductor package, a second semiconductor package. The first semiconductor package includes a first semiconductor package base having a first cavity formed therein, a first mount component mounted in the first cavity, and a first magnet dispose
7400038 Semiconductor device, substrate, equipment board, method for producing semiconductor device, and July 15, 2008
A semiconductor device includes a first substrate having a first surface for mounting an electronic component and a second surface substantially parallel to the first surface. The first substrate includes a first region for mounting the electronic component, a second region including a
7351068 Semiconductor device April 1, 2008
A semiconductor device includes a first plate member having a circuit surface on which a circuit is provided, a second plate member having a circuit surface on which a circuit is provided, a plurality of first flat plates disposed on the circuit surface of the first plate member, a first
7027347 Semiconductor memory device April 11, 2006
A semiconductor memory device for improving the utilization of a shared data bus and the data transfer rate in a multi-bank DRAM and realizing high speed data accessing without increasing a scale of a control circuit, wherein the multi-bank DRAM has memory banks provided with an addr
7012831 Semiconductor memory device March 14, 2006
A semiconductor memory device for realizing high speed writing while maintaining the credibility of write data, wherein a write gate is provided between a bit line and an input/output data line of a memory cell array, the write gate becomes open when a selected word line becomes an a
5841688 Matched delay word line strap November 24, 1998
A circuit is designed with a first lower conductor (500) having two ends. One end of the first lower conductor is coupled to a first signal source (386). A first upper conductor (544) has two ends and is spaced apart from the first lower conductor by a distance less than an allowable spa
5764580 Semiconductor integrated circuit June 9, 1998
A semiconductor integrated circuit capable of preventing the excessive overdriving of sense amplifiers when the supply voltage fed thereto is raised. The integrated circuit has differential amplifiers for amplifying a potential difference on complementary signal lines, and a control
5293564 Address match scheme for DRAM redundancy scheme March 8, 1994
An address match scheme is disclosed which allows the alternate selection of fuses blown based on either logic ones or logic zeros in an address.
5257228 Efficiency improved DRAM row redundancy circuit October 26, 1993
A redundancy scheme for a memory is disclosed which allows defect correction, particularly, word line to word line short correction through the use of a minimal number of redundant lines. The scheme makes use of some logical function of the non-matching address bits of two word lines


 
 
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