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Browse by: INVENTOR PATENT HOLDER PATENT NUMBER DATE
 
 
Inventor:
Sugimoto; Atsuhiko
Address:
Aichi, JP
No. of patents:
1
Patents:












Patent Number Title Of Patent Date Issued
7122894 Wiring substrate and process for manufacturing the same October 17, 2006
A wiring substrate incorporating nickel-plated copper terminal pads for solder bumps, wherein a nickel plating layer constituting the nickel plated copper terminal pads has a phosphorus content of 8.5 to 15.0% by mass and is covered with a gold plating layer.










 
 
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