Resources Contact Us Home
Browse by: INVENTOR PATENT HOLDER PATENT NUMBER DATE
 
 
Inventor:
Sugimoto; Atsuhiko
Address:
Aichi, JP
No. of patents:
1
Patents:












Patent Number Title Of Patent Date Issued
7122894 Wiring substrate and process for manufacturing the same October 17, 2006
A wiring substrate incorporating nickel-plated copper terminal pads for solder bumps, wherein a nickel plating layer constituting the nickel plated copper terminal pads has a phosphorus content of 8.5 to 15.0% by mass and is covered with a gold plating layer.










 
 
  Recently Added Patents
Method and computed tomography device and data storage medium for performing a dynamic CT examination on a patient
Semiconductor device and method of adjusting characteristic thereof
Methods of forming semiconductor devices having diffusion regions of reduced width
Summarization of short comments
Dimmable LED light fixture having adjustable color temperature
Sink
Cooking oven with energy saving mode and method
  Randomly Featured Patents
Poly(alkylene cyclohexane-dicarboxylate) binary blends
Ink cartridge
Transceiver suitable for data communications between wearable computers
Grouping logic circuit in a pipelined superscalar processor
Engine having resistance to particle deposits
Method of making a flexible membrane circuit tester
Automobile door locking systems
Protection circuit for integrated circuits
Insulated electric heating element
Method of wiring for motorcycles