Resources Contact Us Home
Browse by: INVENTOR PATENT HOLDER PATENT NUMBER DATE
 
 
Inventor:
Sugai; Shinzo
Address:
Tokyo, JP
No. of patents:
2
Patents:












Patent Number Title Of Patent Date Issued
5341025 IC package and LSI package using a lead frame formed of a copper-zirconium alloy August 23, 1994
An IC package and LSI package having a lead frame of a copper alloy that contains 0.1 to 1% by weight of chromium, 0.01 to 0.5% by weight of zirconium and that has partial discolored regions caused by unbalanced precipitation of the zirconium distributed thereon at a rate of 2 grains
5210441 Lead frame formed of a copper-zirconium alloy May 11, 1993
A lead frame comprising a copper alloy containing 0.1 to 1 % by weight of chromium, 0.01 to 0.5% by weight of zirconium and having partial discolored regions caused by unbalanced precipitation of the zirconium distributed thereon at a rate of 2 grains/100 cm.sup.2 or less. The lead f










 
 
  Recently Added Patents
Session transfer method, application server, and communications system
Methods, systems, and products for providing ring backs
Base station, relay station, and bandwidth allocation method
Resource capacity monitoring and reporting
Photoelectric conversion device
Indicating transfer in an IMS network
Electric washing machine
  Randomly Featured Patents
Container for an offshore fishing lure
System for accessing a disc drive with defect information
Liquid metal switch apparatus
Accessory attachment structure for a V-shaped engine
Method for making high yield-low carbon ceramic via polysilazane
Pocket penlight
Digital signal communication system for multi-level modulation including unique encoder and decoder
Electrolytic decontamination
X-ray cathode and method of manufacture thereof
Connection mode setting apparatus, connection mode setting method, connection mode control apparatus, connection mode control method and so on