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Inventor: Sugai; Shinzo
Address: Tokyo, JP
No. of patents: 2
Patents:
| Patent Number |
Title Of Patent |
Date Issued |
| 5341025 |
IC package and LSI package using a lead frame formed of a copper-zirconium alloy |
August 23, 1994 |
| An IC package and LSI package having a lead frame of a copper alloy that contains 0.1 to 1% by weight of chromium, 0.01 to 0.5% by weight of zirconium and that has partial discolored regions caused by unbalanced precipitation of the zirconium distributed thereon at a rate of 2 grains |
| 5210441 |
Lead frame formed of a copper-zirconium alloy |
May 11, 1993 |
| A lead frame comprising a copper alloy containing 0.1 to 1 % by weight of chromium, 0.01 to 0.5% by weight of zirconium and having partial discolored regions caused by unbalanced precipitation of the zirconium distributed thereon at a rate of 2 grains/100 cm.sup.2 or less. The lead f |
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