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Browse by: INVENTOR PATENT HOLDER PATENT NUMBER DATE
 
 
Inventor:
Sugai; Shinzo
Address:
Tokyo, JP
No. of patents:
2
Patents:












Patent Number Title Of Patent Date Issued
5341025 IC package and LSI package using a lead frame formed of a copper-zirconium alloy August 23, 1994
An IC package and LSI package having a lead frame of a copper alloy that contains 0.1 to 1% by weight of chromium, 0.01 to 0.5% by weight of zirconium and that has partial discolored regions caused by unbalanced precipitation of the zirconium distributed thereon at a rate of 2 grains
5210441 Lead frame formed of a copper-zirconium alloy May 11, 1993
A lead frame comprising a copper alloy containing 0.1 to 1 % by weight of chromium, 0.01 to 0.5% by weight of zirconium and having partial discolored regions caused by unbalanced precipitation of the zirconium distributed thereon at a rate of 2 grains/100 cm.sup.2 or less. The lead f










 
 
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