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Browse by: INVENTOR PATENT HOLDER PATENT NUMBER DATE
 
 
Inventor:
Stevens; Joe
Address:
San Jose, CA
No. of patents:
10
Patents:












Patent Number Title Of Patent Date Issued
6599402 Electro-chemical deposition cell for face-up processing of single semiconductor substrates July 29, 2003
An apparatus and method for electro-chemically depositing a uniform metal layer onto a substrate is provided. In one aspect, the apparatus includes a cathode connected to the substrate plating surface, an anode disposed above the substrate support member and an electroplating solution in
6516815 Edge bead removal/spin rinse dry (EBR/SRD) module February 11, 2003
The present invention provides an apparatus for etching a substrate, comprising: a container; a substrate support disposed in the container; a rotation actuator attached to the substrate support; and a fluid delivery assembly disposed in the container to deliver an etchant to a periphera
6475357 Inflatable compliant bladder assembly November 5, 2002
The present invention provides a bladder assembly for use in an electroplating cell. The bladder assembly comprises a mounting plate, a bladder, and an annular manifold. One or more inlets are formed in the mounting plate and are coupled to a fluid source. The manifold is adapted to
6416647 Electro-chemical deposition cell for face-up processing of single semiconductor substrates July 9, 2002
The invention provides an electro-chemical deposition cell for face-up processing of semiconductor substrates comprising a substrate support member, a cathode connected to the substrate plating surface, an anode disposed above the substrate support member and an electroplating solution
6267853 Electro-chemical deposition system July 31, 2001
The present invention provides an electro-chemical deposition system that is designed with a flexible architecture that is expandable to accommodate future designs and gap fill requirements and provides satisfactory throughput to meet the demands of other processing systems. The elec
6251236 Cathode contact ring for electrochemical deposition June 26, 2001
The present invention provides a cathode contact ring for use in an electroplating cell. The contact ring comprises an insulative body having a substrate seating surface and one or more conducting members disposed in the insulative body. The conducting members provide discrete conducting
6228233 Inflatable compliant bladder assembly May 8, 2001
The present invention provides a bladder assembly 130 for use in an electroplating cell 100. The bladder assembly 130 comprises a mounting plate 132, a bladder 136, and an annular manifold 146. One or more inlets 142 are formed in the mounting plate 146 and are coupled to a fluid source
5993170 Apparatus and method for compressing high purity gas November 30, 1999
An improved method and apparatus are disclosed for isolating product gas from compressor operating fluid. A portion of a piston rod directly exposed to the compressor's operating fluid (the oily portion of the piston rod) is atmospherically isolated from the remaining portion of the
5990453 High pressure/high temperature process chamber November 23, 1999
An improved processing chamber is provided that withstands numerous high pressure/high temperature processing cycles without heater breakage. The processing chamber contains a high conductivity, a high emissivity and/or a high transmissivity shield positioned in sufficient proximity to a
5810931 High aspect ratio clamp ring September 22, 1998
The present invention provides a method and apparatus for protecting the edge of a substrate and securing the substrate to the support member during processing. The present invention preferably provides minimal contact with the substrate and provides improved edge exclusion. Support










 
 
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