| Patent Number |
Title Of Patent |
Date Issued |
| 6977014 |
Architecture for high throughput semiconductor processing applications |
December 20, 2005 |
| A semiconductor wafer processing system in accordance with an embodiment of the present invention includes a loading station, a load lock, a process module, an intermediate process module, and a transport module which further includes a load chamber, a transfer chamber, and a pass-throug |
| 6722835 |
System and method for processing semiconductor wafers including single-wafer load lock |
April 20, 2004 |
| A wafer processing system employing a single-wafer load lock with integrated cooling unit is disclosed. The small volume of the single-wafer load lock allows for fast pump down and vent cycles. By integrating a cooling unit within the load lock, system throughput is further increased |
| 6712907 |
Magnetically coupled linear servo-drive mechanism |
March 30, 2004 |
| The mechanism comprises a magnetically coupled drive mechanism for transporting semiconductor wafers in a semiconductor wafer processing system. The mechanism includes an actuator within a cylinder that contains a set of magnets that drive a complementary set of magnets inside a carr |
| 6561796 |
Method of semiconductor wafer heating to prevent bowing |
May 13, 2003 |
| Bowing of semiconductor wafers during heating is reduced by heating the wafers in a gas with a thermal conductivity and mean free path greater than that of oxygen, or by heating the wafers in a processing chamber under a pressure less than 0.1 Torr. In one embodiment, the high thermal |
