| Patent Number |
Title Of Patent |
Date Issued |
| 8130506 |
Sensor module |
March 6, 2012 |
| A sensor module. One embodiment provides a cap whose perimeter defines a rim. A first semiconductor chip is attached to the cap. The first semiconductor chip includes first connection elements. The rim and the first connection elements define a common plane. |
| 7635911 |
Chip carrier and system including a chip carrier and semiconductor chips |
December 22, 2009 |
| A chip carrier includes a first surface and a second surface that opposes the first surface. The chip carrier acts as a heat sink for semiconductor chips arranged on it. A first recess is provided in the first surface, and a second recess is provided in the second surface. First and seco |
| 7557417 |
Module comprising a semiconductor chip comprising a movable element |
July 7, 2009 |
| The invention relates to a module comprising a carrier, a first semiconductor chip applied to the carrier and having a movable element and a second semiconductor chip applied to the first semiconductor chip, wherein an active first main surface of the first semiconductor chip faces t |
| 7453509 |
Digital camera with a transparent core disposed between a lens and a light-sensitive sensor |
November 18, 2008 |
| A digital camera has a lens, a camera housing, and a semiconductor sensor. The camera housing is primarily formed of a transparent plastic block that encloses a semiconductor sensor only on its underside and has an adapted lens on its top side. Between the two there is provided an opaque |
| 7221048 |
Multilayer circuit carrier, panel, electronic device, and method for producing a multilayer circ |
May 22, 2007 |
| A multilayer circuit carrier, electronic devices and panel, and a method for producing a multilayer circuit carrier include at least one semiconductor chip, at least one rewiring layer with a rewiring structure, and at least one insulation layer, which has passage structures. |
| 7056764 |
Electronic sensor device and method for producing the electronic sensor device |
June 6, 2006 |
| An electronic sensor device has at least one sensor component, which bears on a bearing base of a rewiring structure. Contact areas of the sensor component are electrically conductively connected to contact pads of the rewiring structure. External contact areas of the rewiring structure |
| 6784551 |
Electronic device having a trimming possibility and at least one semiconductor chip and method f |
August 31, 2004 |
| An electronic device has a semiconductor chip and a passive component, whose electrical values can be varied. The semiconductor chip is electrically conductively connected to a rewiring structure that, together with the semiconductor chip and with the passive component, is enclosed by |
| 6614661 |
Covering device for ceramic modules |
September 2, 2003 |
| The covering device covers a ceramic module with electronic components arranged between a ceramic substrate and an upper covering plate of the covering device. The covering device is spaced apart by spacers from the surface of the ceramic substrate fitted with components. The covering |
| 6313514 |
Pressure sensor component |
November 6, 2001 |
| The pressure sensor component has a chip carrier carrying a semiconductor chip with an integrated pressure sensor having a pressure-detecting surface exposed to the pressure to be measured. A device encapsulation made from an electrically insulating material surrounds the entire asse |
| 6201467 |
Pressure sensor component and production method |
March 13, 2001 |
| The pressure sensor component has a chip carrier with an approximately planar chip carrier surface. A semiconductor chip with an integrated pressure sensor is placed on the chip carrier surface. A pressure-detecting surface area of the pressure sensor is exposed to a pressure to be m |
| 6186008 |
Semiconductor sensor component |
February 13, 2001 |
| A housing for a semiconductor sensor configuration, in which a sensor and an evaluation logic are integrated in a semiconductor body is disclosed. The housing has a base body upon which the semiconductor body is applied and a cover that encloses the semiconductor body in the base body. T |
| 6058020 |
Component housing for surface mounting of a semiconductor component |
May 2, 2000 |
| A component housing for surface mounting of a semiconductor component on a component-mounting surface of a printed circuit board. The component housing including a chip carrier made of an electrically insulating material and having an approximately planar chip carrier area, a semicon |
