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Browse by: INVENTOR PATENT HOLDER PATENT NUMBER DATE
 
 
Inventor:
Stadler; Bernd
Address:
Donaustauf, DE
No. of patents:
12
Patents:












Patent Number Title Of Patent Date Issued
8130506 Sensor module March 6, 2012
A sensor module. One embodiment provides a cap whose perimeter defines a rim. A first semiconductor chip is attached to the cap. The first semiconductor chip includes first connection elements. The rim and the first connection elements define a common plane.
7635911 Chip carrier and system including a chip carrier and semiconductor chips December 22, 2009
A chip carrier includes a first surface and a second surface that opposes the first surface. The chip carrier acts as a heat sink for semiconductor chips arranged on it. A first recess is provided in the first surface, and a second recess is provided in the second surface. First and seco
7557417 Module comprising a semiconductor chip comprising a movable element July 7, 2009
The invention relates to a module comprising a carrier, a first semiconductor chip applied to the carrier and having a movable element and a second semiconductor chip applied to the first semiconductor chip, wherein an active first main surface of the first semiconductor chip faces t
7453509 Digital camera with a transparent core disposed between a lens and a light-sensitive sensor November 18, 2008
A digital camera has a lens, a camera housing, and a semiconductor sensor. The camera housing is primarily formed of a transparent plastic block that encloses a semiconductor sensor only on its underside and has an adapted lens on its top side. Between the two there is provided an opaque
7221048 Multilayer circuit carrier, panel, electronic device, and method for producing a multilayer circ May 22, 2007
A multilayer circuit carrier, electronic devices and panel, and a method for producing a multilayer circuit carrier include at least one semiconductor chip, at least one rewiring layer with a rewiring structure, and at least one insulation layer, which has passage structures.
7056764 Electronic sensor device and method for producing the electronic sensor device June 6, 2006
An electronic sensor device has at least one sensor component, which bears on a bearing base of a rewiring structure. Contact areas of the sensor component are electrically conductively connected to contact pads of the rewiring structure. External contact areas of the rewiring structure
6784551 Electronic device having a trimming possibility and at least one semiconductor chip and method f August 31, 2004
An electronic device has a semiconductor chip and a passive component, whose electrical values can be varied. The semiconductor chip is electrically conductively connected to a rewiring structure that, together with the semiconductor chip and with the passive component, is enclosed by
6614661 Covering device for ceramic modules September 2, 2003
The covering device covers a ceramic module with electronic components arranged between a ceramic substrate and an upper covering plate of the covering device. The covering device is spaced apart by spacers from the surface of the ceramic substrate fitted with components. The covering
6313514 Pressure sensor component November 6, 2001
The pressure sensor component has a chip carrier carrying a semiconductor chip with an integrated pressure sensor having a pressure-detecting surface exposed to the pressure to be measured. A device encapsulation made from an electrically insulating material surrounds the entire asse
6201467 Pressure sensor component and production method March 13, 2001
The pressure sensor component has a chip carrier with an approximately planar chip carrier surface. A semiconductor chip with an integrated pressure sensor is placed on the chip carrier surface. A pressure-detecting surface area of the pressure sensor is exposed to a pressure to be m
6186008 Semiconductor sensor component February 13, 2001
A housing for a semiconductor sensor configuration, in which a sensor and an evaluation logic are integrated in a semiconductor body is disclosed. The housing has a base body upon which the semiconductor body is applied and a cover that encloses the semiconductor body in the base body. T
6058020 Component housing for surface mounting of a semiconductor component May 2, 2000
A component housing for surface mounting of a semiconductor component on a component-mounting surface of a printed circuit board. The component housing including a chip carrier made of an electrically insulating material and having an approximately planar chip carrier area, a semicon










 
 
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