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Inventor:
Skrovan; John
Address:
Boise, ID
No. of patents:
16
Patents:












Patent Number Title Of Patent Date Issued
6739955 Apparatus and methods for conditioning polishing pads in mechanical and/or chemical-mechanical p May 25, 2004
Conditioning systems and methods for conditioning polishing pads used in mechanical and chemical-mechanical planarization of microelectronic-device substrate assemblies. In one aspect of the invention, a conditioning system includes a conditioning element or conditioning member having a
6509272 Planarization method using fluid composition including chelating agents January 21, 2003
A planarization method including the provision of a wafer having a wafer surface. A pad is positioned for contact with the wafer surface and the wafer surface is planarized using the pad and a fluid composition that includes a chelating agent. The chelating agent is a water soluble m
6391779 Planarization process May 21, 2002
A series of process steps is described for the planarization of a semiconductor substrate, such as a semiconductor wafer, using a linear track polisher, a rotational polisher, or the combination of both. The process steps include a first processing step at a first polishing pressure
6280924 Planarization method using fluid composition including chelating agents August 28, 2001
A planarization method including the provision of a wafer having a wafer surface. A pad is positioned for contact with the wafer surface and the wafer surface is planarized using the pad and a fluid composition that includes a chelating agent. The chelating agent is a water soluble m
6277746 Methods of reducing corrosion of materials, methods of protecting aluminum within aluminum-compr August 21, 2001
In one aspect, the invention includes a semiconductor processing method of reducing corrosion of a material, comprising exposing the material to a liquid solution comprising at least about 5% (by atomic percent) of an oxygen-comprising oxidant to form an oxide layer over the material. In
6203413 Apparatus and methods for conditioning polishing pads in mechanical and/or chemical-mechanical p March 20, 2001
Conditioning systems and methods for conditioning polishing pads used in mechanical and chemical-mechanical planarization of microelectronic-device substrate assemblies. In one aspect of the invention, a conditioning system includes a conditioning element or conditioning member having a
6136218 Planarization fluid composition including chelating agents October 24, 2000
A planarization method including the provision of a wafer having a wafer surface. A pad is positioned for contact with the wafer surface and the wafer surface is planarized using the pad and a fluid composition that includes a chelating agent. The chelating agent is a water soluble m
6110830 Methods of reducing corrosion of materials, methods of protecting aluminum within aluminum-compr August 29, 2000
In one aspect, the invention includes a semiconductor processing method of reducing corrosion of a material, comprising exposing the material to a liquid solution comprising at least about 5% (by atomic percent) of an oxygen-comprising oxidant to form an oxide layer over the material. In
6060395 Planarization method using a slurry including a dispersant May 9, 2000
A planarization method includes providing a wafer surface and positioning a pad for contact with the wafer surface. The wafer surface is then planarized using the pad and a slurry. The slurry includes a dispersant which is one of any micellar forming surfactants. Preferably, the disp
6048405 Megasonic cleaning methods and apparatus April 11, 2000
A cleaning method for use in fabrication of integrated circuit devices includes providing a surface of a substrate assembly. The surface is exposed to a cleaning solution having megasonic energy projected therethrough. Gas bubbles are passed across the surface. A gas flow is introduc
6006765 Megasonic cleaning methods and apparatus December 28, 1999
A cleaning method for use in fabrication of integrated circuit devices includes immersing a surface of a substrate assembly into a cleaning solution having a first pH. The first pH of the cleaning solution is controlled by introducing gas bubbles into the cleaning solution. The gas b
5916819 Planarization fluid composition chelating agents and planarization method using same June 29, 1999
A planarization method including the provision of a wafer having a wafer surface. A pad is positioned for contact with the wafer surface and the wafer surface is planarized using the pad and a fluid composition that includes a chelating agent. The chelating agent is a water soluble m
5849091 Megasonic cleaning methods and apparatus December 15, 1998
A cleaning method for use in fabrication of integrated circuit devices includes providing a surface of a substrate assembly. The surface is exposed to a cleaning solution having megasonic energy projected therethrough. Gas bubbles are passed across the surface. A gas flow is introduc
5846336 Apparatus and method for conditioning a planarizing substrate used in mechanical and chemical-me December 8, 1998
An apparatus for chemically conditioning a surface of a planarizing substrate while a semiconductor wafer is planarized on the substrate. The conditioning apparatus has a conditioning solution dispenser that deposits a conditioning solution onto the substrate, and a conditioning solution
5827781 Planarization slurry including a dispersant and method of using same October 27, 1998
A planarization method includes providing a wafer surface and positioning a pad for contact with the wafer surface. The wafer surface is then planarized using the pad and a slurry. The slurry includes a dispersant which is one of any micellar forming surfactants. Preferably, the disp
5645682 Apparatus and method for conditioning a planarizing substrate used in chemical-mechanical planar July 8, 1997
An apparatus for chemically conditioning a surface of a planarizing substrate while a semiconductor wafer is planarized on the substrate. The conditioning apparatus has a conditioning solution dispenser that deposits a conditioning solution onto the substrate, and a conditioning solution










 
 
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