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Inventor: Shiv; Lior
Address: Hilleroed, DK
No. of patents: 3
Patents:
| Patent Number |
Title Of Patent |
Date Issued |
| 7553695 |
Method of fabricating a package for a micro component |
June 30, 2009 |
| Techniques are disclosed for fabricating a relatively thin package for housing a micro component, such as an opto-electronic or MEMs device. The packages may be fabricated in a wafer-level batch process. The package may include hermetically sealed feed-through electrical connections |
| 7531445 |
Formation of through-wafer electrical interconnections and other structures using a thin dielect |
May 12, 2009 |
| Providing through-wafer interconnections in a semiconductor wafer includes forming a sacrificial membrane in a pre-existing semiconductor wafer, depositing metallization over one side of the wafer so as to cover exposed portions of the sacrificial membrane facing the one side of the |
| 7470622 |
Fabrication and use of polished silicon micro-mirrors |
December 30, 2008 |
| A method of fabricating silicon micro-mirrors includes etching from opposite sides of a silicon wafer with a polished surface on at least one of the opposite sides, to form silicon bars each having a parallelogram-shaped cross-section and including a portion of the polished surface. |
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