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Inventor: Shiomi; Yutaka
Address: Toyonaka, JP
No. of patents: 3
Patents:
| Patent Number |
Title Of Patent |
Date Issued |
| 5780145 |
Filler-containing resin composition suitable for injection molding and transfer molding |
July 14, 1998 |
| A molding resin composition containing, in a resin, a filler comprising a globular powder of which mean particle diameter is not smaller than 0.1 .mu.m and not greater than 1.5 .mu.m (x component), a globular powder of which mean particle diameter is not smaller than 2 .mu.m and not grea |
| 5719225 |
Filler-containing resin composition suitable for injection molding and transfer molding |
February 17, 1998 |
| A molding resin composition containing, in a resin, a filler comprising a globular powder of which mean particle diameter is not smaller than 0.1 .mu.m and not greater than 1.5 .mu.m (x component), a globular powder of which mean particle diameter is not smaller than 2 .mu.m and not grea |
| 5644003 |
Epoxy resin composition, process for producing the same and resin-sealed semiconductor device |
July 1, 1997 |
| An epoxy resin composition which comprises: (a) an epoxy resin having at least two epoxy groups in the molecule, (b) an epoxy resin curing agent, (c) a cure accelerator, (d) an aromatic polyamide pulp and (e) an inorganic filler as the essential components, the aromatic polyamide pulp |
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