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Inventor: Shin; Hyoun Soo
Address: Seoul, KR
No. of patents: 5
Patents:
| Patent Number |
Title Of Patent |
Date Issued |
| D595243 |
Light-emitting diode |
June 30, 2009 |
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| D579425 |
Light-emitting diode |
October 28, 2008 |
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| 7456438 |
Nitride-based semiconductor light emitting diode |
November 25, 2008 |
| A nitride-based semiconductor LED which is flip-chip bonded on a lead pattern of a sub-mount through a bump ball comprises a substrate; a light-emitting structure formed on the substrate; an electrode formed on the light-emitting structure; a protective film formed on the resulting s |
| 7235818 |
Flip chip type nitride semiconductor light emitting device and manufacturing method thereof |
June 26, 2007 |
| Disclosed herein are a flip chip type nitride semiconductor light emitting device, which comprises a substrate for growing a nitride semiconductor material, an n-type nitride semiconductor layer formed on the substrate, an active layer formed on at least a part of the n-type nitride |
| 6949773 |
GaN LED for flip-chip bonding and method of fabricating the same |
September 27, 2005 |
| A GaN light emitting diode for flip-chip bonding, with sufficient bonding area, optimized electrode arrangement, and improved brightness and reliability, includes n-electrodes and a p-electrode which are formed as stripes. The n-electrodes are positioned at equal distances from the p |
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